A heat-dissipating photovoltaic backplane and its preparation method
A photovoltaic backplane and heat dissipation technology, applied in photovoltaic power generation, chemical instruments and methods, final product manufacturing, etc., can solve the problem of affecting the photoelectric conversion efficiency of cells, the decrease of cell efficiency, and the impact of heat dissipation on the conversion efficiency of solar cells. Service life and other issues, achieve excellent insulation performance and heat dissipation performance, improve bonding performance, and excellent heat dissipation performance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0021] The method for preparing a heat-dissipating photovoltaic backplane provided by the present invention includes the following steps:
[0022] 1) A plurality of via holes are respectively formed in the first metal substrate and the third metal substrate, and a plurality of columnar protrusions are respectively formed on the upper surface and the lower surface of the second metal substrate;
[0023] 2) Coat the adhesive on one side of the fluororesin outer weathering layer and the EVA layer respectively, and apply the adhesive on the upper and lower surfaces of the PET layer and the PEN layer respectively, and dry them;
[0024] 3) Laying the fluororesin outer weathering layer on the lower surface of the first metal substrate, laying a PET layer on the upper surface of the first metal substrate, and then laying the second metal substrate on the PET layer, Next, a PEN layer is laid on the upper surface of the second metal substrate, then the third metal substrate is laid on the PEN...
Embodiment 1
[0029] A method for preparing a heat-dissipating photovoltaic backplane includes the following steps:
[0030] 1) A plurality of via holes are respectively formed in the first metal substrate and the third metal substrate, a plurality of columnar protrusions are respectively formed on the upper surface and the lower surface of the second metal substrate, the first metal substrate and the third metal substrate A plurality of via holes in the metal substrate are arranged in a matrix, and a plurality of columnar protrusions on the upper surface and the lower surface of the second metal substrate are arranged in a matrix. The diameter of the via holes is 4 mm. The distance between the columnar protrusions is 8 mm, the diameter of the columnar protrusions is 4 mm, the distance between adjacent columnar protrusions is 8 mm, and the material of the first, second, and third metal substrates is aluminum;
[0031] 2) Apply adhesive to one side of the fluororesin outer weathering layer and on...
Embodiment 2
[0036] A method for preparing a heat-dissipating photovoltaic backplane includes the following steps:
[0037] 1) A plurality of via holes are respectively formed in the first metal substrate and the third metal substrate, a plurality of columnar protrusions are respectively formed on the upper surface and the lower surface of the second metal substrate, the first metal substrate and the third metal substrate A plurality of via holes in the metal substrate are arranged in a matrix, and a plurality of columnar protrusions on the upper surface and the lower surface of the second metal substrate are arranged in a matrix. The diameter of the via holes is 5 mm. The distance between the columnar protrusions is 7 mm, the diameter of the columnar protrusions is 5 mm, the distance between adjacent columnar protrusions is 7 mm, and the material of the first, second, and third metal substrates is copper;
[0038] 2) Apply adhesive to one side of the fluororesin outer weathering layer and one ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| diameter | aaaaa | aaaaa |
| peel strength | aaaaa | aaaaa |
| peel strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More