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Heat conduction plate

A heat conduction plate and flat plate technology, applied in the field of heat exchange, can solve the problems of low production efficiency, cumbersome manufacturing methods, difficulty in high-efficiency mass production, etc., and achieve the effect of simple manufacturing process

Inactive Publication Date: 2018-06-26
BEIJING FULLLINK OREITH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The existing heat pipe structure is fixed, the heat dissipation is air-heat pipe heat dissipation, the heat dissipation efficiency is not high, and the heat conduction plate can directly contact with the heat dissipation device, which improves the heat transfer efficiency
A flat aluminum microporous heat pipe described in patent CN2014105908906 adopts a plate-shaped heat exchanger, which increases the contact area with the heat dissipation device. Low production efficiency, difficult to efficiently mass produce

Method used

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Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0020] Such as figure 1 , 2 It is a schematic diagram of the heat conduction plate (1), and its manufacturing process includes the following steps:

[0021] 1. First make two rectangular metal plates by stamping or casting.

[0022] 2. Apply an absorbent film (15) to the inner surfaces of both metal plates.

[0023] 3. Seal the two metal plates around, and place a liquid filling tube (16) with a diameter of about 1-2mm on the edge. The specific method is: apply a certain thickness of welding filler material on the edge of the lower metal plate (12) , and then align the upper and lower metal plates, and place the liquid filling tube (16) on the edge of any side between the upper and lower metal plates (11; 12), and finally use brazing or laser welding...

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Abstract

The invention discloses a heat conduction plate which is mainly composed of a metal shell, liquid absorption films located inside the metal shell, a working medium and a liquid filling pipe. The metalshell is composed of an upper metal plate and a lower metal plate, and the inner surfaces of the upper metal plate and the lower metal plate are each coated with a liquid absorption film. The edges of the upper metal plate and the lower metal plate are sealed through a welding process, the metal shell internally provided with cavities is formed, and the strength of the shell is increased by welding reinforcing points to the middles of the metal plates. The internal cavities of the metal plate shell communicate with one another, and the working medium can be injected into the whole metal plateshell at a time. The liquid filling pipe penetrates through the side face of the metal shell and communicates with the internal cavities of the metal shell, vacuumizing and injecting of the working medium are facilitated. The heat conduction plate has the following advantages that heat transfer directions are isotropic, and the heat conduction plate can be used for heat dissipation of a point heat source, a linear heat source and a plane heat source; the fabrication process is simple, and mass-production can be performed; and the heat conduction plate can be produced into different shapes tobe adapted to heat dissipation components. The heat conduction plate can be widely applied to heat dissipation of electronic products or constant-temperature heating of food and chemical equipment, and the heat conduction plate can also be used as a heat exchanger.

Description

technical field [0001] The invention relates to the technical field of heat exchange, in particular to a heat conducting plate. Background technique [0002] The current heat transfer elements mostly use heat pipes, which transfer heat through the phase-change latent heat of the working medium in the sealed vacuum tube shell. The medium inside the heat pipe is heated and evaporated in the heating section, and after rising to the upper part, it condenses and releases heat in the heat dissipation section. The heat transfer performance of the heat pipe is similar to the electrical conductivity of a superconductor, so it has the characteristics of large heat transfer capacity and high heat transfer efficiency. Because of its superior heat transfer performance and technical characteristics, it is widely used in the field of energy saving. At present, heat pipes are commonly used in equipment cooling, waste heat recovery, and fresh air systems. [0003] The existing heat pipe st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02
CPCF28D15/02
Inventor 祝长宇
Owner BEIJING FULLLINK OREITH TECH CO LTD