Single-side chip discharging machine

Abstract

The invention discloses a single-side chip discharging machine. The single-side chip discharging machine comprises a silicon chip conveying mechanism, a detection mechanism and a chip sending mechanism, wherein the silicon chip conveying mechanism comprises first conveying pieces arranged in a matrix manner, the first conveying pieces located in the first row are arranged in a horizontal conveyingmanner, the first conveying pieces located in other rows are arranged in a longitudinal conveying manner, the first conveying pieces, arranged in the longitudinal conveying manner, in the last row are in butt joint with silicon chips conveyed from the former station, a recognition unit is arranged on each first conveying piece, and a recovery box is arranged by corresponding to the recognition units; the detection mechanism is in butt joint with the silicon chip conveying mechanism, and the silicon chip conveying mechanism selectively conveys silicon chips to the detection mechanism; a secondconveying piece is arranged on the chip sending mechanism and is in butt joint with a carrier and the silicon chip conveying mechanism. The single-side chip discharging machine can provide debuggingspace for a worker and realize chip discharging and full-automatic detection of the silicon chips, and the working efficiency is improved.

Description

technical field [0001] The invention relates to the field of photovoltaic manufacturing, in particular to a single-side unloading machine. Background technique [0002] In the photovoltaic industry chain, the manufacture of solar cells is the core link. At present, solar cells mainly use silicon solar cells. The general method of manufacturing silicon solar cells is to firstly process P-type or N-type silicon wafers with clean surfaces to form a textured surface. structure; secondly, diffuse junction on the surface of the silicon wafer to form an N+ or P+ emitter, remove the diffusion layer on the side and back of the silicon wafer through wet etching; then form a layer of SiN film with anti-reflection function on the front surface ; Finally, metal electrodes are made on the front and back of the silicon wafer, and crystalline silicon solar cells are formed through a sintering process. Among them, impurity phosphorus or boron is produced during the diffusion junction, and p...

AI Technical Summary

Problems solved by technology

However, in the traditional production process, the silicon wafers are directly transported by the double-sided unloading machine into the wet process pool for etching, and are directly transported away from the double-sided unloading machine after etching. Sampling inspection of the weighing unit also cannot provide a detection space for the weighing unit

In addition, because the transmission mechanism for the unloading machine is set on both sides, it cannot provide enough space for the staff to check and adjust. If the weighing unit finds that the silicon wafer does not meet the standard, the staff cannot carry out close inspection of the machine. Therefore, such a structure not only cannot realize automatic and efficient transportation such as unloading and weighing, but also greatly reduces the qualified rate of silicon wafers, resulting in a series of bad phenomena such as battery leakage, which cannot Meet existing production needs

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