Polyphenylene sulfide resin composition with low dielectric constant and used for NMT (Nano Molding Technology) and preparation method

A technology of polyphenylene sulfide resin and low dielectric constant, applied in the field of engineering plastics, can solve the problems of high dielectric constant, unable to meet the long wavelength, high frequency and large capacity of 5G communication, and achieve high reaction rate and heat resistance Excellent performance and moldability, fast response

Inactive Publication Date: 2018-07-06
SHENZHEN HALCYON NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Polyphenylene sulfide (PPS) is one of the most commonly used special materials for nano-injection molding, but it has the disadvantage of high dielectric constant (above 3.6, 1GHZ), which cannot meet the requirements of long wavelength, high frequency and large capacity of 5G communication

Method used

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  • Polyphenylene sulfide resin composition with low dielectric constant and used for NMT (Nano Molding Technology) and preparation method
  • Polyphenylene sulfide resin composition with low dielectric constant and used for NMT (Nano Molding Technology) and preparation method
  • Polyphenylene sulfide resin composition with low dielectric constant and used for NMT (Nano Molding Technology) and preparation method

Examples

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Effect test

Embodiment 1

[0060] Embodiment 1: The polyphenylene sulfide resin composition of this embodiment includes the following components in parts by mass:

[0061]

[0062] The preparation method of the polyphenylene sulfide resin composition in the present embodiment is as follows:

[0063] According to the proportion, mix the above-mentioned PPS resin, hollow microspheres, toughening agent, antioxidant, heat stabilizer and lubricant to obtain a mixture;

[0064] Add glass fiber to the mixture, put it into an extruder, carry out melt extrusion and granulation, stir evenly, and obtain a polyphenylene sulfide resin composition.

[0065] The heating temperature of the extruder is set as follows: Zone 1 160-200 °C, Zone 2 220-250 °C, Zone 3 230-270 °C, Zone 4 250-290 °C, Zone 5 270-310 °C, Zone 6 280-320 °C And machine head 260 ~ 280 ℃.

Embodiment 2

[0066] Embodiment 2: The polyphenylene sulfide resin composition of this embodiment includes the following components in parts by mass:

[0067]

[0068] The preparation method of the polyphenylene sulfide resin composition of this example is the same as that of Example 1.

Embodiment 3

[0069] Embodiment 3: The polyphenylene sulfide resin composition of this embodiment includes the following components in parts by mass:

[0070]

[0071]

[0072] Among them, the glass fiber is a low dielectric constant chopped glass fiber, the hollow microsphere is a polymer microsphere, the inorganic hollow microsphere is a hollow glass microsphere, and the toughening agent is glycidyl methacrylate copolymer and styrene / butylene Diene / styrene block copolymer, the nucleating agent is long-chain fatty acid calcium.

[0073] The preparation method of the nano-injection-molded polyphenylene sulfide resin composition in this example is the same as that in Example 1.

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Abstract

The invention provides a polyphenylene sulfide resin composition with low dielectric constant and a preparation method. The polyphenylene sulfide resin composition is prepared from the following maincomponents in parts by mass: 20-80 parts of PPS resin, 15-40 parts of glass fiber, 0.5-10 parts of hollow microsphere, 3-15 parts of toughening agent, 0.3-3 parts of antioxidant, 0.3-3 parts of heat stabilizer, 0.5-2 parts of lubricant and 0-3 parts of core forming agent. The polyphenylene sulfide resin composition with low dielectric constant and the preparation method provided by the invention have the beneficial effects that the dielectric constant of the polyphenylene sulfide resin composition is low, is 3.0-3.4 under the testing condition of 5GHz and is far lower than that of ordinary nanometer injection molding PPS special materials; the polyphenylene sulfide resin composition has high drawing force in injection molding with metal, even reaches 220kgf / cm<2> or more and is applicableto the NMT (Nano Molding Technology); the heat resistance is good, the processing temperature is 280 DEG C or more and can reach 310 DEG C at highest.

Description

technical field [0001] The invention relates to the technical field of engineering plastics, in particular to a low dielectric constant polyphenylene sulfide resin composition for NMT technology and a preparation method. Background technique [0002] Nano Injection Molding Technology (NMT) is a technology that directly injects plastic onto the metal surface to achieve perfect bonding with the metal. It can be used to replace traditional bonding methods such as gluing, in-mold cladding, and metal riveting to achieve light, thin, For short and small purposes, the products manufactured by nano-molding technology have a very broad potential market and have both low price advantages and processing costs. [0003] The fifth generation of mobile phone mobile communications, abbreviated as 5G. The planned transmission rate of 5G mobile communication will be as high as 10-50Gbps, which is more than 10 times the transmission rate of 4G mobile communication. The arrival of 5G technol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L81/02C08L101/00C08L33/14C08L53/02C08K7/14C08K7/28C08K5/098
CPCC08L81/02C08L2201/08C08L2205/035C08L2205/20C08L101/00C08L33/14C08L53/02C08K7/14C08K7/28C08K5/098
Inventor 曹艳霞谭光凤陆永健赖华林邓冬颜
Owner SHENZHEN HALCYON NEW MATERIALS
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