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Preparation and application of a graphene/silicon composite thermal grease

A technology of thermally conductive silicone grease and graphene, which is applied in the preparation of graphene/silicon composite thermally conductive silicone grease and the field of graphene/silicon composite thermally conductive silicone grease, and can solve problems such as thermally conductive resins that do not use silicon-based graphene.

Inactive Publication Date: 2020-10-27
林荣铨
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, there is still room for improvement in the thermal conductivity of the above-mentioned thermally conductive silicone grease, and there is no thermally conductive resin using silicon-based graphene in the prior art.

Method used

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  • Preparation and application of a graphene/silicon composite thermal grease
  • Preparation and application of a graphene/silicon composite thermal grease
  • Preparation and application of a graphene/silicon composite thermal grease

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Embodiment 1

[0031] Embodiment 1: the present invention provides a kind of preparation method of modified graphene heat conduction silicone grease, comprises the following steps:

[0032] (1) Add 1 g of graphene powder into a mixed system of 500 mL of water and ethanol, and ultrasonically disperse it into a suspension.

[0033] (2) Add 5g of nano-silicon particles after cleaning in the dispersion, after ultrasonic dispersion, mechanically stir for 12h at 55°C to obtain a graphene / silicon composite material dispersion, wherein graphene and nano-silicon particles are physically adsorbed way combined.

[0034] (3) Dry the prepared graphene / silicon composite material dispersion by spray drying to obtain graphene / silicon composite material powder.

[0035] (4) Place the graphene / silicon composite powder in a vacuum oven at 65°C and dry it in vacuum for 1 hour to remove residual moisture in the graphene / silicon composite powder and to remove the residual moisture from the graphene / silicon compo...

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Abstract

The invention discloses preparation and an application of graphene / silicon composite heat conduction silicone grease. Graphene prepared through a liquid phase ultrasonic stripping method is taken as the raw material, the graphene and a nanometer silicon particle are physically adsorbed through a mechanical mixing method to form a graphene / silicon composite, and the dispersity of the graphene in the heat conduction silicone grease and the compatibility of the heat conduction silicone grease are improved. Then the graphene / silicon composite is taken as a heat conduction filler, a heat conductionsilicone grease matrix is adopted, a graphene / silicon composite powder is added by means of vacuum stirring and is evenly dispersed in the heat conduction silicone grease to form the novel graphene / silicon composite heat conduction silicone grease, and the heat is effectively dissipated after the graphene / silicon composite heat conduction silicone grease is applied to the joint between an LED lamp bead and a radiating fin or a base.

Description

technical field [0001] The invention relates to thermally conductive silicone grease, in particular to a graphene / silicon composite thermally conductive silicone grease and a preparation method of graphene / silicon composite thermally conductive silicone grease. Background technique [0002] Thermally conductive silicone grease (also known as heat dissipation paste) is a paste-like thermal interface heat conduction material, which can be used for heat dissipation or heat dissipation of heat dissipation components. It has good thermal conductivity and is often used in electronic products and other fields. Its main features are: it can be applied to quickly release the heat generated when electronic products are used, and it can also be used in aerospace, electronic and electrical fields that require heat dissipation, heat transfer or insulation; it can timely eliminate the heat generated during the use of electronic equipment. A large amount of heat plays an important role in ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K9/12C08K3/04C08K3/02C08L83/04
CPCC08K3/02C08K3/04C08K9/12C08K2003/023C08L2203/20C08L83/04
Inventor 林荣铨
Owner 林荣铨
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