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Silicon material cleaning device

A cleaning device and technology for silicon materials, applied in cleaning methods and utensils, cleaning methods using tools, cleaning methods using liquids, etc., can solve problems such as large loss of silicon materials, improve quality, reduce costs, and reduce acid consumption. less effect

Inactive Publication Date: 2018-07-17
广德盛源电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Silicon material is first oxidized by nitric acid and then reacted with hydrofluoric acid in the cleaning process. The silicon material is corroded by acid to remove a layer of surface layer to achieve the cleaning effect. After cleaning, the loss of silicon material is relatively large.

Method used

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Effect test

Embodiment 1

[0029] see Figure 1-2 As shown, the technical solution adopted in the present invention is: a silicon material cleaning device, the main structure of the silicon material cleaning device is designed as a cleaning tank 1, a cleaning tank cover 3 is placed on the top of the cleaning tank 2, and the cleaning tank cover 3 is placed on the top of the cleaning tank 2. A cleaning drum 3 is installed in the groove 1, and a cleaning brush 5 is installed inside the cleaning drum 3. The cleaning drum 3 is powered by a drive motor 6, and a speed regulating device 77 is installed on the right side of the drive motor 6. A connecting bearing 8 is installed between the speed regulating device 7 and the cleaning tank 1, an ultrasonic generator 4 is installed on the bottom of the cleaning tank 1, and a water outlet pipe 9 is arranged on the middle and lower part of the right side of the cleaning tank 1. 1 The top of the right side is provided with a water inlet pipe 11, and a spray device 10 i...

Embodiment 2

[0040] The difference between this embodiment and embodiment 1 is:

[0041] The concentration of the aqueous ethanol solution contained in the aqueous ethanol tank 13 is 8%.

[0042] The lye contained in the lye tank 14 is a dilute mixed solution of sodium hydroxide and sodium carbonate, wherein the concentration of the dilute mixed solution of sodium hydroxide and sodium carbonate is designed to be 6%.

[0043] The acid liquid inside the acid liquid tank 16 is a dilute mixed solution of hydrofluoric acid, nitric acid and hydrochloric acid, wherein the concentration of the dilute mixed solution of hydrofluoric acid, nitric acid and hydrochloric acid is designed to be 5%.

Embodiment 3

[0045] The difference between this embodiment and embodiment 1 is:

[0046] The concentration of the aqueous ethanol solution contained in the aqueous ethanol tank 13 is 10%.

[0047] The lye contained in the lye tank 14 is a dilute mixed solution of sodium hydroxide and sodium carbonate, wherein the concentration of the dilute mixed solution of sodium hydroxide and sodium carbonate is designed to be 10%.

[0048] The acid liquid inside the acid liquid tank 16 is a dilute mixed solution of hydrofluoric acid, nitric acid and hydrochloric acid, wherein the concentration of the dilute mixed solution of hydrofluoric acid, nitric acid and hydrochloric acid is designed to be 6%.

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Abstract

The invention discloses a silicon material cleaning device. A main body structure of the silicon material cleaning device is designed as a cleaning tank, a cleaning tank cover is placed at the top ofthe cleaning tank, a cleaning roller is installed in the cleaning tank, and a cleaning brush is installed in the cleaning roller. The cleaning roller is powered by a driving motor, a speed adjusting device is installed on the right side of the driving motor, a connecting bearing is installed between the speed adjusting device and the cleaning tank, and an ultrasonic generator is installed at the bottom of the cleaning tank. According to the silicon material cleaning device, impurities on the surface of silicon materials can be cleaned effectively, the reaction is stable, and almost no heat isproduced, the oxidation reaction is not produced, so that contamination to silicon materials caused by oxidation is avoided to improve the quality of the silicon materials; dilute hydrofluoric acid does not react with silicon, so that the loss rate of the silicon materials is reduced; and the acid consumption is low so as to greatly reduce the cost of cleaning the silicon materials, energy is saved effectively, broad market potentials are achieved, and market demands can be met.

Description

technical field [0001] The invention relates to the technical field of cleaning devices for materials used in electronic and electrical parts, in particular to a silicon material cleaning device. Background technique [0002] China's photovoltaic industry has entered a new stage of rapid development. The industrial chains of raw silicon, silicon wafers, cells, modules, etc. seem to be independent of each other but are closely linked. The output of primary silicon determines the healthy and stable development of downstream industries. How to make more and better use of other silicon raw materials is also a technical problem for silicon wafer manufacturers. [0003] In the photovoltaic industry, each process will produce excess silicon material waste, such as scrap material, which is the excess monocrystalline silicon material surrounding the usable part during the cutting process of the single crystal rod, and its quality is equivalent to that of finished silicon wafers; , t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/08B08B3/06B08B3/12B08B3/02B08B1/02B08B1/20
CPCB08B3/022B08B3/06B08B3/08B08B3/123B08B1/20B08B1/12
Inventor 盛广喜
Owner 广德盛源电器有限公司
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