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A three-dimensional assembly and packaging structure of a microwave module based on a silicon-aluminum alloy box

A technology of silicon-aluminum alloy and packaging structure, which is applied in the direction of semiconductor devices, electric solid-state devices, semiconductor/solid-state device components, etc., can solve the problem of low integration, incapable of hermetic packaging, and high integration of three-dimensional and three-dimensional components. The urgent requirements and other issues, to achieve the effect of solving high integration requirements and improving integration

Active Publication Date: 2019-10-25
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the packaging design form of this microwave module is still limited in integration. It can only be two-dimensionally assembled or packaged in the single cavity of the housing, including electronic circuits such as heat sinks, bare chips, components, and substrates. Meet the urgent requirements of microwave multi-chip modules in phased array radar for high integration of three-dimensional and three-dimensional components
In addition, conventional three-dimensional stacked or three-dimensionally assembled microwave multi-chip modules are mostly simple and mechanically repetitive stacked, with low integration and cannot be directly hermetically packaged.

Method used

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  • A three-dimensional assembly and packaging structure of a microwave module based on a silicon-aluminum alloy box
  • A three-dimensional assembly and packaging structure of a microwave module based on a silicon-aluminum alloy box
  • A three-dimensional assembly and packaging structure of a microwave module based on a silicon-aluminum alloy box

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preparation example Construction

[0039]The silicon-aluminum alloy raw materials with different compositional gradients are prepared through an integrated molding process to obtain gradient aluminum-silicon electronic packaging materials, and then the raw materials are processed into a designed structural form; this process can be adopted with a patent number: 201510812388. The technical solution titled "A Preparation Method for Gradient Aluminum-Silicone Electronic Packaging Material" was prepared, and the specific steps included: (1) Aluminum-silicon material was prepared by casting or powder metallurgy, and silicon particle refinement was obtained by friction stir processing. , dense aluminum-silicon alloy with uniform distribution; (2) Drill evenly distributed blind holes on the aluminum-silicon alloy, fill the holes with silicon powder and compact them, and obtain a certain thickness of aluminum-silicon composite material layer through friction stir processing (3) Repeating step (2), by controlling the siz...

Embodiment 1

[0047] Such as Figure 1-2 As shown, a three-dimensional assembly and packaging structure of a microwave module based on a silicon-aluminum alloy box in the present invention consists of a cover plate 1, a housing 2, and two functional units 3 composed of an electronic substrate, heat sink, bare chip, components, etc. , the first functional unit 31 is assembled on the inner side of the cover plate, the second functional unit 32 is assembled on the inner side of the bottom of the housing, the connector 4 includes a low frequency connector 41, a radio frequency connector 42, and ribs 5 between adjacent functional units composition.

[0048] In this embodiment, the cover plate is a silicon-aluminum alloy with a grade of CE11, the shell is a gradient alloy of different components of silicon-aluminum, and the transition layer is a silicon-aluminum alloy with a grade of CE13, wherein the bottom material of the casing is CE11, and the integrated The frame material (including transit...

Embodiment 2

[0055] The difference from Embodiment 1 lies in: 1) the installation position of the connector, 2) the number and position of the lugs of the housing, specifically related to the following:

[0056] Such as Figure 3-4 As shown, a three-dimensional assembly and packaging structure of a microwave module based on a silicon-aluminum alloy box in the present invention consists of a cover plate 1, a housing 2, and two functional units 3 composed of an electronic substrate, heat sink, bare chip, components, etc. , the first functional unit 31 is assembled on the inner side of the cover plate, the second functional unit 32 is assembled on the inner side of the bottom of the housing, the connector 4 includes a low frequency connector 41, a radio frequency connector 42, and ribs 5 between adjacent functional units composition.

[0057] Among them, the cover plate 1 is silicon-aluminum alloy of grade CE11, and the shell 2 is a silicon-aluminum gradient alloy, and is respectively a sili...

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Abstract

The invention discloses a silicon-aluminum-alloy-case-based three-dimensional assembling and packaging structure of a microwave module. The assembling and packaging structure comprises a split type case body and one or more functional units. The case body includes an inner cavity type shell and one and more flat type cover plates; the shell includes one or more inner cavities. In packaging, the inner cavity is in sealed connection by the cover plate; the function units are assembled to the bottom of the inner cavity and the inner side of the cover plate; and the case body is formed by stackingof at least three different silicon-aluminum alloy material with different components. The assembling and packaging structure has the following beneficial effects: three-dimensional assembling and packaging inside the microwave module are realized; compared with the traditional microwave module only assembling components at the bottom of the inner cavity of the shell, the assembling and packagingstructure enables the integration rate to be improved by two for four times; and with the silicon aluminum alloy, the size and the mass are reduced, the thermal stress reliability is improved, and the heat dissipation performance is enhanced.

Description

technical field [0001] The invention relates to an electronic packaging technology, in particular to a three-dimensional assembly and packaging structure of a microwave module based on a silicon-aluminum alloy box. Background technique [0002] Modern airborne and spaceborne radar systems have multiple functions, light load, small space, and low power consumption, which is reflected in the urgent technical requirements for lightweight, integrated, and high reliability in radar system engineering research. T / R components and other microwave modules, which are important components of modern radars such as phased array radars and spaceborne SAR radar systems, can account for 60-70% of the cost of the entire radar, and are often the most integrated, lightweight components in radar systems. For components with the highest requirements for quantification and reliability, how to design microwave modules such as T / R components that meet the requirements of quality, volume, integrati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/06H01L23/04
CPCH01L23/04H01L23/06
Inventor 陈奇海霍绍新孙浩殷东平宋夏陈兴国王传伟周明智
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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