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Diamond cutter for ultrathin sapphire glass cutting and preparation method thereof

A technology for diamond cutting and sapphire glass, which is applied in the field of diamond cutting knives for ultra-thin sapphire glass cutting and its preparation, which can solve the problems affecting the qualified yield of wafers, low cutting rate, deep line marks on the surface, etc., and achieve high strength , strong deoxidation, narrow knife marks

Active Publication Date: 2018-07-27
苏州赛尔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high hardness of sapphire (hardness level 9), processing is difficult. For example, even if advanced nano-laser is used for cutting, micro-cracks will be generated on the cutting surface due to thermal melting problems. In addition, a diamond wire saw with a diameter of 0.25mm is used. Although cut sapphire can be cut into pieces, the rate of cutting pieces is low, and the surface lines are deep, which affects the qualified yield of wafers

Method used

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  • Diamond cutter for ultrathin sapphire glass cutting and preparation method thereof
  • Diamond cutter for ultrathin sapphire glass cutting and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] A metal-based matrix for a diamond cutter, the components and mass content of which are as follows:

[0047] Copper Powder 50%

[0048] Tin powder 27%

[0049] Cobalt powder 6%

[0050] Titanium powder 6%

[0051] Aluminum powder 8%

[0052] Lanthanum metal 3%

[0053] The preparation method of diamond cutter for cutting ultra-thin sapphire glass comprises the following steps:

[0054] (1) Material mixing: According to the above ratio, put the accurately weighed copper powder, tin powder, cobalt powder, titanium powder, aluminum powder, and metal lanthanum into the three-dimensional mixer, and pre-mix for 2 hours to obtain the metal matrix; Then add graphite powder and diamond, mix for 10 hours, pass through an 80-mesh sieve and put it in a dry container for later use; the mass ratio of metal-based matrix, graphite powder and diamond is 80:3:17;

[0055] (2) Compression molding: pass the prepared material through a 200-mesh screen, sieve 4 times to ensure that the...

Embodiment 2

[0061] A metal-based matrix for a diamond cutter, the components and mass content of which are as follows:

[0062] Copper powder 42%

[0063] Tin powder 34%

[0064] Cobalt Powder 11%

[0065] Titanium powder 5%

[0066] Aluminum powder 6%

[0067] Lanthanum metal 2%

[0068] The preparation method of diamond cutter for cutting ultra-thin sapphire glass comprises the following steps:

[0069] (2) Material mixing: According to the above ratio, put the accurately weighed copper powder, tin powder, cobalt powder, titanium powder, aluminum powder, and metal lanthanum into the three-dimensional mixer, and pre-mix for 2 hours to obtain the metal matrix; Then add graphite powder and diamond, mix for 10 hours, pass through an 80-mesh sieve and place in a dry container for later use; the mass ratio of the metal-based matrix, graphite powder and diamond is 82:2:16;

[0070] (2) Compression molding: pass the prepared material through a 200-mesh screen, sieve 4 times to ensure that t...

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Abstract

The invention discloses a diamond cutter for ultrathin sapphire glass cutting and a preparation method thereof. The preparation method comprises the following steps: sieving a mixture of a metal-basedgreen body, graphite powder and diamond, and then performing cold pressing to obtain a cold-pressed green body, wherein the metal-based green body is prepared from copper powder, tin powder cobalt powder, titanium powder, aluminum powder and lanthanum metal; sintering the cold-pressed green body to obtain a formed body, wherein the sintering treatment is performed at temperature of 600 to 700 DEGC for 25 to 35 minutes, and a heating rate is 25 to 35 DEG C / min; and machining the formed body to obtain the diamond cutter for ultrathin sapphire glass cutting. The diamond cutter can be used for cutting sapphire with extremely high hardware, particularly used for cutting ultrathin sapphire, and can avoid cutting damage and increase the qualification rate.

Description

technical field [0001] The invention belongs to the technical field of cutting knives, and in particular relates to a diamond cutting knife for cutting ultra-thin sapphire glass and a preparation method thereof. Background technique [0002] Sapphire is used in electronic products due to its excellent mechanical and optical properties. For example, it is used in lens modules as a protective cover or in mobile phones as a front cover to protect the lens module and mobile phone with wear-resistant and impact-resistant properties. However, due to the high hardness of sapphire (hardness level 9), processing is difficult. For example, even if advanced nano-laser is used for cutting, micro-cracks will be generated on the cutting surface due to thermal melting problems. In addition, a diamond wire saw with a diameter of 0.25mm is used. Although cut sapphire can be cut into pieces, the rate of cutting pieces is low, and the surface lines are deep, which affects the qualified yield o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00C22C26/00C22C30/04B22F5/00B28D5/02
CPCB22F1/0003B22F2005/001B22F2998/10B28D5/02C22C9/02C22C26/00C22C30/02C22C30/04B22F3/02B22F3/10
Inventor 李威王丽萍陈昱刘学民冉隆光
Owner 苏州赛尔科技有限公司