Groove infield plate buried layer termination structure of semiconductor device and manufacturing method

A terminal structure, semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of destroying the wafer, the optimization degree of terminal voltage efficiency and terminal area is difficult to achieve great improvement, etc. The effect of high terminal efficiency

Active Publication Date: 2018-07-27
JILIN SINO MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this technical solution is that when the trench is deep, the wide trench at the end will seriously damage the wafer
Its technical solution is an improvement based on

Method used

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  • Groove infield plate buried layer termination structure of semiconductor device and manufacturing method
  • Groove infield plate buried layer termination structure of semiconductor device and manufacturing method
  • Groove infield plate buried layer termination structure of semiconductor device and manufacturing method

Examples

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preparation example Construction

[0050] The preparation method includes: providing a semiconductor substrate, the semiconductor substrate has a plurality of grooves and a plurality of semiconductor pillars, and two adjacent grooves are separated by semiconductor pillars. Push-junction is performed from one or more of the plurality of semiconductor pillars to the body of the semiconductor substrate to form a floating buried doping layer extending below the bottom of the trench. Inner field plates are formed in some of the plurality of trenches. Wherein, the part of the floating doping diffusion buried layer below the bottom of the trench is partially connected, or completely connected, or partially spaced, or completely spaced.

[0051] Further, as a preferred solution, the preparation method includes:

[0052] forming a selective implant mask on the surface of the semiconductor substrate;

[0053] Perform impurity implantation with a conductivity type opposite to that of the semiconductor substrate to form ...

Embodiment 1

[0063] see figure 1 , this embodiment provides a terminal structure of a semiconductor device.

[0064] like figure 1 As shown, the terminal portion of the semiconductor device is a patterned structure formed on the N-type semiconductor 2 .

[0065] The terminal part includes a plurality of grooves with regular density. The figure shows groove 4a1 , groove 4a2 , groove 4a3 , groove 4a4 , groove 4a5 , groove 4a6 , groove 4a6 , groove 4a8 , groove 4b and groove 5 .

[0066] In the plurality of trenches, each trench has a field oxide layer 6 , and all the field oxide layers 6 extend from the trench to the top surface of the terminal structure and are further connected as a whole. Additionally, if figure 1 As shown, the field oxide layer 6 is completely filled in the trench 4b (the oxide filling formed by the field oxidation in the trench 4b). The field oxide layer 6 formed in the trench 4a1, the trench 4a2, the trench 4a3, the trench 4a4, the trench 4a5, the trench 4a6, the ...

Embodiment 2

[0077] refer to Figure 2-Figure 19 , the present invention provides a method for manufacturing the terminal structure of the field plate buried layer in the trench of the semiconductor device described in Embodiment 1.

[0078] The manufacturing method includes the following steps:

[0079] Step 1: On the surface of N-type semiconductor 2 (single wafer or epitaxial wafer, such as silicon single wafer or silicon epitaxial wafer), form a selective implantation mask 1, such as figure 2 shown.

[0080] Step 2: Perform P-type impurity implantation to form a P-type impurity-doped layer 3 (with the opposite conductivity type to the N-type semiconductor 2), such as image 3 shown. After implantation, the selective implantation mask 1 (mask layer) is removed.

[0081] Step 3: Form a trench etching mask 11 after the photolithography process by thermal oxidation or depositing an oxide layer, such as Figure 4 shown.

[0082] Step 4: Perform trench etching.

[0083] The etching d...

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Abstract

A groove infield plate buried layer termination structure of a semiconductor device and a manufacturing method belongs to the field of the semiconductor device. The termination structure of the semiconductor device includes an air floating doping buried layer and a plurality of grooves, which are located in a semiconductor area of the semiconductor device. An n-shaped infield plate is formed in atleast one groove among the grooves, and an m-shaped infield plate is formed in at least one groove. The termination structure has good termination efficiency, and the voltage endurance can be easilyadjusted through the number of the grooves and the length of the air floating doping buried layer.

Description

technical field [0001] The invention relates to the field of semiconductor devices, in particular to a terminal structure and a manufacturing method of a buried layer of a field plate in a trench of a semiconductor device. Background technique [0002] In order to reduce the voltage drop or on-state resistance of devices including a metal oxide semiconductor structure (MOS), with the progress of semiconductor technology, MOS devices with a trench structure have gradually become the mainstream of products. Such as trench MOSFET (Trench PowerMOSFET), trench Schottky barrier diode (TMBS diode), trench IGBT (Trench IGBT) and other trench structure power semiconductor devices. For the termination of MOS devices with trench structure, the termination technology of planar devices is more used, such as field plate technology, field limiting ring termination technology, JTE termination technology, VLD termination technology, etc. [0003] There are also many improvements aimed at th...

Claims

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Application Information

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IPC IPC(8): H01L21/765H01L27/04H01L29/06
CPCH01L21/765H01L27/04H01L29/0611
Inventor 左义忠
Owner JILIN SINO MICROELECTRONICS CO LTD
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