Solar cell and preparation method thereof
A solar cell and battery technology, applied in the field of solar cells, can solve problems such as reducing the electrical performance of solar cells, and achieve the effects of reducing contact area, increasing open circuit voltage, and increasing open circuit voltage
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Embodiment 1
[0059] Such as figure 1 As shown, this embodiment is a solar cell, which includes the following parts:
[0060] 1) P-type silicon wafer 10: resistivity 2Ω·cm, as an absorption layer, converts the photons that meet the conditions into electrons, the size of the P-type silicon wafer is 2×2cm 2 ;
[0061] 2) n+ diffusion layer 20: also known as emitter, its main function is to form a p-n junction with p-Si to selectively transport electrons, with a depth of about 0.5μm, using POCl 3 As a phosphorus source, it is prepared by diffusion in a tube furnace;
[0062] 3) Silicon nitride anti-reflection film 30: prepared by PECVD deposition, with a thickness of about 75nm;
[0063] 4) Negative electrode 40: obtained by screen printing and high-temperature sintering, used to transport carriers;
[0064] 5) Al 2 O 3 Passivation layer 50: prepared by an atomic layer deposition method, with a thickness of about 5 nm, used to passivate p-type silicon wafers;
Embodiment 2
[0069] Such as figure 2 As shown, this embodiment is a solar cell. The difference from Embodiment 1 is that the high work function semiconductor material layer in this embodiment is two layers, which are divided into a first high work function semiconductor material layer 81 and a first high work function semiconductor material layer 81. Two high work function semiconductor material layers 82, wherein the first high work function semiconductor material layer 81 is 9 nm-V 2 O 5 , The second high work function semiconductor material layer 82 is 3nm-WO 3 . The high work function semiconductor material layer in this embodiment is denoted as 9nm-V 2 O 5 / 3nm-WO 3 , The other parts are the same as in Example 1.
Embodiment 3
[0071] This embodiment is a solar cell. Compared with Embodiment 2, the difference is that the high work function semiconductor material layer is different. The high work function semiconductor material layer in this embodiment is 9nm-V 2 O 5 / 6nm-WO 3 , The other parts are the same as in Example 2.
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