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Textured substrate capable of enhancing electrical stability of flexible device in mechanical stress

A technology of mechanical stress and flexible electronic devices, applied in semiconductor devices, circuits, photovoltaic power generation, etc., can solve problems such as various loads, thermal expansion coefficient material property mismatch, etc., achieve significant technical economy, reduce failure behavior, The effect of reducing the cost of preparation and processing

Active Publication Date: 2018-08-14
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the multilayer film structure composed of inorganic materials composed of ZnO thin film, metal layer and organic material PI, there is a serious mismatch in material properties such as thermal expansion coefficient and elastic modulus, and mutual constraints between layers are easy to occur at the interface. various loads

Method used

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  • Textured substrate capable of enhancing electrical stability of flexible device in mechanical stress
  • Textured substrate capable of enhancing electrical stability of flexible device in mechanical stress
  • Textured substrate capable of enhancing electrical stability of flexible device in mechanical stress

Examples

Experimental program
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Effect test

preparation example Construction

[0062] The preparation method of the flexible ZnO nanowire ultraviolet detector and the detection of its electrical stability under mechanical stress are characterized in that it comprises the following steps:

[0063] Step 1: Glue the cleaned textured and smooth flexible substrates with a size of 1cm×1cm on the pre-prepared silicon wafer with high temperature resistant double-sided adhesive, divide the samples into two groups, each group contains a texture Substrate and a smooth substrate, and rinse again, and then dry the sample;

[0064] Step 2: patterning the entire substrate by photolithography;

[0065] Step 3: On the patterned sample, the ZnO film was sputtered by radio frequency magnetron sputtering. In order to compare the combination of the ZnO film and the two flexible substrates under different sputtering powers, that is, different ZnO film qualities, the first group The sputtering power of the sample is 150W, and the sputtering power of the second group of sample...

Embodiment 1

[0074] Ultrasonic cleaning was used to test the bonding strength of textured and smooth substrates to ZnO thin films:

[0075] The height difference between adjacent peaks and troughs on the textured PI substrate surface is 10-100nm, the distance between two adjacent peaks or two troughs is 50-500nm, and the roughness Ra is 6.54 in the range of 10μm×10μm. nm, such as figure 1 (a). The surface of the smooth substrate used is within the range of 10 μm × 10 μm, and the roughness Ra is 1.18 nm, such as figure 1 (c).

[0076] The cleaned textured and smooth flexible PI substrates of 1cm×1cm in size and 100μm in thickness were glued to the pre-prepared silicon wafer with high-temperature-resistant double-sided adhesive, and cleaned again, and then the samples were dried and passed through radio frequency magnetron sputtering. A 130nm thick ZnO film was sputtered with a sputtering power of 150W. The images under the optical microscope and the AFM images of the two PI substrates us...

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Abstract

The invention discloses a textured substrate capable of enhancing electrical stability of a flexible device in mechanical stress, and relates to the technical field of a semiconductor. By taking a flexible ZnO nanowire array ultraviolet detector as demonstrative verification, influence of the substrate appearance to the electrical stability of the flexible device under the effect of mechanical stress is researched. Compared with a smooth organic thin film, the organic thin film substrate with a textured structure has higher film base binding strength with ZnO, so that the problems of easy buckling, cracking and the like of the film base structure of the flexible device are relieved, and the electrical stability of the flexible device under the effect of mechanical stress is improved.

Description

technical field [0001] The invention relates to the field of semiconductor technology, and specifically refers to a textured flexible substrate that enhances the bonding strength between a film and a substrate, thereby enhancing the electrical stability of flexible electronic devices under mechanical stress. Background technique [0002] Flexible electronics is an emerging electronic technology built on bendable or stretchable substrates, and flexible electronic devices can still function normally under bending, compression or stretching. With its unique flexibility, ductility, and good durability, it has broad application prospects in many fields such as information, medical, and smart wearable devices, such as flexible sensors, flexible displays, flexible electronic skins, organic light-emitting diodes ( OLED), thin-film solar cells, etc. [0003] At present, most research focuses on the function and performance of the device, and little attention is paid to the electrica...

Claims

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Application Information

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IPC IPC(8): H01L31/0236H01L31/101
CPCH01L31/02366H01L31/101Y02E10/50
Inventor 高志远赵立欢张洁陆利伟邹德恕
Owner BEIJING UNIV OF TECH
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