A dual optical path laser marking equipment and marking method thereof

Abstract

The invention provides a dual-optical-path laser marking apparatus and a making method thereof. The dual-optical-path laser marking apparatus comprises a rack assembly, a camera assembly, a lifting platform mechanism, a jig assembly, a mirror assembly and an optics and galvanometer system. The camera assembly is used for carrying out bias detection on optical paths. The jig assembly is fixed to the lifting platform mechanism. The optics and galvanometer system comprises a platform, an optical fiber nanosecond laser device and a picosecond laser device, an optical path system, a galvanometer and a field lens, wherein the optical fiber nanosecond laser device and the picosecond laser device are fixed to the platform, the optical path system is arranged in front of the optical fiber nanosecond laser device and the picosecond laser device, the galvanometer is connected with the optical path system, and the field lens is located below the galvanometer. Lasers respectively emitted by the optical fiber nanosecond laser device and the picosecond laser device pass through the optical path system, then enter the galvanometer in an incidence manner, and carry out laser processing on productsthrough the field lens. According to the dual-optical-path laser marking apparatus, the picosecond laser device is used for carrying out high-speed outline scanning on products, the nanosecond laser device is used for outline filling, the processing quality is effectively guaranteed, and the production efficiency is improved at the same time.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a dual optical path laser marking device and a marking method thereof. Background technique [0002] In the consumer electronics industry, more and more products need to be marked with LOGO or serial number somewhere after assembly, as a transmission of corporate image and a key element of product quality. [0003] For example, the laser marking equipment marks the surface of a certain brand of wearable products on stainless steel. Depth processing with ultra-fast laser. In the laser marking process, since the picosecond laser photons directly destroy the structural bonds of the target material, this is relatively a "cold" processing with a small heat-affected area, and the entire processing process is very clean without recasting the material. As a surface treatment, nanosecond laser has a certain heat-affected zone, which can frequently recast materials and micro-process the p...

AI Technical Summary

Problems solved by technology

[0006] 1. Using a two-dimensional linear platform, the CCD moves twice after taking pictures, which is easy to cause cumulative errors;

[0007] 2. One-time CCD camera does not have re-inspection function and cannot correct deviation;

[0008] 3. The cost of using a two-dimensional platform is high

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