Anti-vulcanization LED package silicone material and preparation method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 宁波安工电子有限公司
- Publication Date
- 2018-08-17
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the technical field of LED packaging organic silicon materials, in particular to an anti-vulcanization LED packaging organic silicon material and a preparation method thereof. Background technique
[0002] LED is called the fourth-generation lighting source or green energy. It has the characteristics of energy saving, environmental protection and long life. It is mainly composed of chips, wires, brackets, conductive glue, packaging materials, etc. The packaging materials affect the performance and use of LED The most critical factor of life. Silicone encapsulation material has excellent insulation, weather resistance, ultraviolet resistance and high light transmittance. It is an ideal LED encapsulation material and has gradually replaced epoxy resin as an LED encapsulation material. In the production process of LED, LED vulcanization often occurs. In the early stage of vulcanization, it mainly manifests as blackening of the fu...