Anti-vulcanization LED package silicone material and preparation method thereof

A technology of LED encapsulation and organic silicon, which is applied in the field of anti-vulcanization LED encapsulation organosilicon materials and its preparation, can solve problems affecting the use of LEDs, reducing luminous flux, color temperature drift, etc., and achieves extended service life, excellent anti-vulcanization performance, and parameters reasonable effect
CN108410171AInactive Publication Date: 2018-08-17宁波安工电子有限公司

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
宁波安工电子有限公司
Publication Date
2018-08-17
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses an anti-vulcanization LED package silicone material and a preparation method thereof, and the anti-vulcanization LED package silicone material comprises the following raw materials: hexamethyldisiloxane, octamethylcyclotetrasiloxane, di(dimethylsilane)tetraphenylcyclotetrasiloxane, 1,1,3,3-tetramethyl-1,3-divinyldisiloxane, Karstedt catalyst, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, tetramethylthiuram disulfide and low hydrogen silicone oil; the preparation method comprises the following steps: S1, preparation of the raw materials; S2; preparation of a base material; S3, copolymer preparation; S4, copolymer modification and vulcanization. The anti-vulcanization LED package silicone material proposed by the invention has reasonable formula, good anti-vulcanization performance and good stability, and the preparation method is simple in operation, clear in process and reasonable in parameters.
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Description

technical field

[0001] The invention relates to the technical field of LED packaging organic silicon materials, in particular to an anti-vulcanization LED packaging organic silicon material and a preparation method thereof. Background technique

[0002] LED is called the fourth-generation lighting source or green energy. It has the characteristics of energy saving, environmental protection and long life. It is mainly composed of chips, wires, brackets, conductive glue, packaging materials, etc. The packaging materials affect the performance and use of LED The most critical factor of life. Silicone encapsulation material has excellent insulation, weather resistance, ultraviolet resistance and high light transmittance. It is an ideal LED encapsulation material and has gradually replaced epoxy resin as an LED encapsulation material. In the production process of LED, LED vulcanization often occurs. In the early stage of vulcanization, it mainly manifests as blackening of the fu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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