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Anti-vulcanization LED package silicone material and preparation method thereof

A technology of LED encapsulation and organic silicon, which is applied in the field of anti-vulcanization LED encapsulation organosilicon materials and its preparation, can solve problems affecting the use of LEDs, reducing luminous flux, color temperature drift, etc., and achieves extended service life, excellent anti-vulcanization performance, and parameters reasonable effect

Inactive Publication Date: 2018-08-17
宁波安工电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the production process of LED, LED vulcanization often occurs. In the early stage of vulcanization, it mainly manifests as blackening of the functional area of ​​the bracket, which reduces the luminous flux and the color temperature drifts. The problem of complete failure or dead light affects the use of LED

Method used

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  • Anti-vulcanization LED package silicone material and preparation method thereof
  • Anti-vulcanization LED package silicone material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] An anti-vulcanization LED encapsulation organosilicon material proposed by the present invention comprises the following raw materials in parts by weight: 60 parts of hexamethyldisiloxane, 45 parts of octamethylcyclotetrasiloxane, bis(dimethylsilane) tetrasiloxane 30 parts of phenylcyclotetrasiloxane, 6 parts of 1,1,3,3-tetramethyl-1,3-divinyldisiloxane, 0.05 parts of Karstedt catalyst, 2,5-dimethyl-2 , 0.8 parts of 5-bis(tert-butylperoxy)hexane, 0.3 parts of tetramethylthiuram disulfide, and 1 part of low-hydrogen silicone oil.

[0022] Its preparation method comprises the following steps:

[0023] S1. According to 60 parts of hexamethyldisiloxane, 45 parts of octamethylcyclotetrasiloxane, 30 parts of bis(dimethylsilane)tetraphenylcyclotetrasiloxane, 1,1,3,3- 6 parts of tetramethyl-1,3-divinyldisiloxane, 0.05 parts of Karstedt catalyst, 0.8 parts of 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, di 0.3 parts of tetramethylthiuram sulfide, 1 part of low-hydrogen silico...

Embodiment 2

[0029] An anti-vulcanization LED encapsulation organosilicon material proposed by the present invention comprises the following raw materials in parts by weight: 50 parts of hexamethyldisiloxane, 37.5 parts of octamethylcyclotetrasiloxane, bis(dimethylsilane) tetra 25 parts of phenylcyclotetrasiloxane, 5 parts of 1,1,3,3-tetramethyl-1,3-divinyldisiloxane, 0.08 parts of Karstedt catalyst, 2,5-dimethyl-2 , 0.6 parts of 5-bis(tert-butylperoxy)hexane, 0.4 parts of tetramethylthiuram disulfide, and 0.8 parts of low-hydrogen silicone oil.

[0030] Its preparation method comprises the following steps:

[0031] S1. According to 50 parts of hexamethyldisiloxane, 37.5 parts of octamethylcyclotetrasiloxane, 25 parts of bis(dimethylsilane)tetraphenylcyclotetrasiloxane, 1,1,3,3- 5 parts of tetramethyl-1,3-divinyldisiloxane, 0.08 parts of Karstedt catalyst, 0.6 parts of 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, di Prepare 0.4 part of tetramethylthiuram sulfide and 0.8 part of low-hydr...

Embodiment 3

[0037] An anti-vulcanization LED encapsulating organosilicon material proposed by the present invention comprises the following raw materials in parts by weight: 40 parts of hexamethyldisiloxane, 30 parts of octamethylcyclotetrasiloxane, bis(dimethylsilane) tetrasiloxane 20 parts of phenylcyclotetrasiloxane, 4 parts of 1,1,3,3-tetramethyl-1,3-divinyldisiloxane, 0.1 part of Karstedt catalyst, 2,5-dimethyl-2 , 0.5 parts of 5-bis(tert-butylperoxy)hexane, 0.5 parts of tetramethylthiuram disulfide, and 0.5 parts of low-hydrogen silicone oil.

[0038]Its preparation method comprises the following steps:

[0039] S1. According to 40 parts of hexamethyldisiloxane, 30 parts of octamethylcyclotetrasiloxane, 20 parts of bis(dimethylsilane)tetraphenylcyclotetrasiloxane, 1,1,3,3- 4 parts of tetramethyl-1,3-divinyldisiloxane, 0.1 part of Karstedt catalyst, 0.5 part of 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, di 0.5 part of tetramethylthiuram sulfide and 0.5 part of low hydrogen-conta...

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Abstract

The invention discloses an anti-vulcanization LED package silicone material and a preparation method thereof, and the anti-vulcanization LED package silicone material comprises the following raw materials: hexamethyldisiloxane, octamethylcyclotetrasiloxane, di(dimethylsilane)tetraphenylcyclotetrasiloxane, 1,1,3,3-tetramethyl-1,3-divinyldisiloxane, Karstedt catalyst, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, tetramethylthiuram disulfide and low hydrogen silicone oil; the preparation method comprises the following steps: S1, preparation of the raw materials; S2; preparation of a base material; S3, copolymer preparation; S4, copolymer modification and vulcanization. The anti-vulcanization LED package silicone material proposed by the invention has reasonable formula, good anti-vulcanization performance and good stability, and the preparation method is simple in operation, clear in process and reasonable in parameters.

Description

technical field [0001] The invention relates to the technical field of LED packaging organic silicon materials, in particular to an anti-vulcanization LED packaging organic silicon material and a preparation method thereof. Background technique [0002] LED is called the fourth-generation lighting source or green energy. It has the characteristics of energy saving, environmental protection and long life. It is mainly composed of chips, wires, brackets, conductive glue, packaging materials, etc. The packaging materials affect the performance and use of LED The most critical factor of life. Silicone encapsulation material has excellent insulation, weather resistance, ultraviolet resistance and high light transmittance. It is an ideal LED encapsulation material and has gradually replaced epoxy resin as an LED encapsulation material. In the production process of LED, LED vulcanization often occurs. In the early stage of vulcanization, it mainly manifests as blackening of the fu...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08K5/14C08K5/40C08G77/20
CPCC08G77/20C08K5/14C08K5/40C08L83/04
Inventor 朱旭彤张敏吴飞张洪胜何华军
Owner 宁波安工电子有限公司
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