A kind of non-glass fiber type polytetrafluoroethylene film, production method and application thereof

Abstract

The invention discloses a non-glass fiber type teflon film and a manufacture method and application thereof. The manufacture method of the non-glass fiber type teflon film comprises the steps that (1)filler and an organic auxiliary agent are mixed evenly by fully stirring to obtain the filler conducted with surface modification after being dried; (2) the modified filler and teflon powder are mixed to make the modified filler evenly scatter in the teflon to obtain a mixed material; (3) the mixed material is heated, fused and squeezed and evenly applied on a flexible metal foil, and is separated after high temperature baking, sintering and firm formation are carried out to obtain the non-glass fiber type teflon film. The manufacture method of the non-glass fiber type teflon film is simple,easy to implement, easy for mass production, and is used for producing copper-clad plates, and the prepared copper-clad substrate has the advantages of uniform dielectric properties, excellent dimensional stability and the like.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a glass fiber-free polytetrafluoroethylene film, a manufacturing method and an application thereof. Background technique [0002] Copper clad laminates for printed circuits are an extremely important basic material for the electronics industry. Traditional copper-clad laminates are used to manufacture printed circuit boards, which play a role in making, interconnecting and insulating electronic components. In recent years, some special copper clad laminates have also been used to directly manufacture printed electronic components. Due to the miniaturization, light weight, and thinning of electronic products, printed circuit boards must have various high-quality and high-tech features, making printed circuit board manufacturing technology directly related to various contemporary high-tech, and its most important and important material coverage Copper pl...

AI Technical Summary

Problems solved by technology

Since the glass fiber cloth provides a certain mechanical strength to the board in the horizontal latitude and longitude direction, but the mechanical support provided in the vertical direction is not so obvious in the horizontal direction, which causes the dimensional stability of the board to be different in the horizontal and vertical directions. Big difference, the most intuitive difference is that the Z-CTE value of the plate is much larger than the X / Y-CTE value

[0007] As a high-frequency copper-clad laminate, the core performance index is the dielectric performance, and the high-frequency board prepared with glass fiber cloth reinforcement often has the problem of poor uniformity of dielectric properties.

As we all know, there are holes and intersections of warp and weft in the weaving of glass fiber cloth, and the dielectric properties of conventional PTFE high-frequency boards are closely related to the ratio of PTFE to glass fiber cloth, so this causes the void position of glass fiber cloth and the intersection of warp and weft. The dielectric properties of the position are inconsistent, which will cause troubles to the subsequent processing and circuit design of the high-frequency board, and will have a more serious impact on the application of the terminal