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Conductive Adhesive Composition

A conductive and adhesive technology, applied in the direction of conductive adhesives, adhesives, adhesive types, etc., can solve problems such as the decline of adhesion, achieve inhibition of yellowing, high heat resistance, high adhesion Effect

Active Publication Date: 2018-08-28
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such a composition can maintain adhesion and conductivity at a relatively low temperature of 85°C, but has the problem of a significant decrease in adhesion at temperatures higher than Tg (glass transition temperature)

Method used

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  • Conductive Adhesive Composition
  • Conductive Adhesive Composition
  • Conductive Adhesive Composition

Examples

Experimental program
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Effect test

Embodiment 1～17 and comparative example 1～2

[0092] Preparation of Conductive Adhesives

[0093] According to the composition shown in Table 1 below, use a rotary agitator to mix conductive metal particles with epoxy compound, phenoxy resin, diluent or solvent, curing agent, curing accelerator and anti-yellowing agent for 1 hour When checking with the naked eye after the above stirring, after the particles are uniformly dispersed without agglomeration, use a three-roll mill (3-roll mill) to further disperse, and then further add a solvent or diluent for the second half of stirring, and then carry out Degassing to prepare a conductive adhesive.

[0094] [Table 2]

[0095]

[0096] Note: 1) means conductive metal particles (a) 50% by weight + conductive metal particles (b) 25% by weight + conductive metal particles (c) 25% by weight.

[0097] 2) % by weight represents the content of each component based on the total weight of the conductive adhesive composition.

[0098] 3) Parts by weight represent the content of ...

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Abstract

The invention relates to a conductive adhesive composition containing (A) a conductive substance; (B) a cyclohexane series multifunctional epoxy compound as a bonding agent; and more than one selectedfrom (C) a curing agent and (D) a curing accelerator. The conductive adhesive composition exhibits high heat resistance to high glass transition temperature, and suppresses yellowing and exhibits high bonding force in high temperature environment, thereby being suitable for electronic elements.

Description

technical field [0001] The present invention relates to a conductive adhesive composition, and in more detail, to a conductive adhesive composition exhibiting high heat resistance, suppressing yellowing and exhibiting excellent adhesive force in a high-temperature environment . Background technique [0002] Conductive adhesives are widely used in the following situations in the process of manufacturing various electronic devices. Said case is, on a printed circuit board, the case where conductive circuits can be electrically connected or between conductive circuits and other printed circuit boards; between an integrated circuit (IC) chip and a printed circuit board, between the electrodes; between the LED chip and the printed circuit board or between the electrodes; between the electrodes on the solar cell; and so on. [0003] The types of conductive adhesives used vary depending on the type of chip or board, the type of adhesive force, the required environmental resistanc...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J171/00C09J9/02C09J11/06
CPCC09J9/02C09J11/06C09J163/00C08L2203/20C08L2203/206C08K2003/0806C08K2201/006C08K2201/003C08L71/00C08K13/04C08K7/00C08K3/08C08K7/18C08K5/526C08K5/3475C09J11/04H01B1/02C09J171/00
Inventor 朴廷薰金圣培徐东敏
Owner DONGJIN SEMICHEM CO LTD
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