High-precise preparation method of micro-nano structure on flexible film substrate

A technology of micro-nano structure and flexible film, applied in the direction of micro-structure technology, micro-structure device, manufacturing micro-structure device, etc. The effect of high-precision preparation, reduction of production cost and processing difficulty

Active Publication Date: 2018-08-31
INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with the existing processing methods, this method solves the problems that the flexible film is easily deformed by force and not tightly attached to the mask during the micro-nano processing process, so that the line width accuracy and position accuracy of the micro-nano structure are greatly improved. Realized the high-precision preparation of micro-nanostructures on flexible film substrates

Method used

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  • High-precise preparation method of micro-nano structure on flexible film substrate
  • High-precise preparation method of micro-nano structure on flexible film substrate

Examples

Experimental program
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Effect test

example 1

[0031] Such as figure 1 As shown in 1-1, the upper surface edge of a quartz substrate 1 (size φ500mm*5mm) with relatively high flatness (PV=200nm, RMS=50nm) is thinned by 0.5mm from φ440mm to φ500mm to form a relatively An annulus with a reduced height at the center;

[0032] Such as figure 1 As shown in middle 1-2, apply the adhesive polyurethane 2 evenly on the inner side of the thinning ring (range φ450mm to φ470mm) with a brush, and leave a gap of 5mm between the quartz boss to avoid the adhesive Squeezed to reach the upper surface of the boss;

[0033] Such as figure 1 As shown in 1-3, place an annular silicone rubber sealing ring 3 with a size of φ(480-490)mm*0.5mm on the outside of the adhesive polyurethane, and the outer edge of the sealing ring should not exceed the scope of the quartz substrate 1;

[0034] Such as figure 1 As shown in middle 1-4, the flexible polyimide film 5 is fixed by two aluminum fixtures, the upper fixture 4 and the lower fixture 6, and pla...

example 2

[0043] Such as figure 2 As shown in 2-1, the upper surface edge of a circular carbon fiber substrate 11 (size φ500mm*10mm) with a relatively high flatness (PV=4um, RMS=1um) is thinned by 1mm from φ440mm to φ500mm to form a phase An annulus with a lower height than the central position;

[0044] Such as figure 2 As shown in 2-2, apply the adhesive polyurethane 2 evenly on the inner side of the thinning ring (range φ450mm to φ470mm) with a brush, and leave a gap of 5mm between the boss of the carbon fiber base to avoid glue The adhesive is squeezed to reach the upper surface of the boss;

[0045] Such as figure 2 As shown in middle 2-3, place an annular silicone rubber sealing ring 3 with a size of φ(480~490)mm*0.5mm on the outside of the adhesive polyurethane, and the outer edge of the sealing ring should not exceed the scope of the carbon fiber substrate 1;

[0046] Such as figure 2 As shown in middle 2-4, the flexible polyimide film 5 is fixed by two aluminum fixture...

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Abstract

The invention discloses a high-precise preparation method of a micro-nano structure on flexible a film substrate. The preparation method comprises the following steps: firstly closely laminating a tightened flexible film on a hard material substrate surface with high flatness in a gapless way to realize an aim of hardening the flexible film, wherein the stressed flexible film is not prone to produce deformation due to the pressure differential between the upper surface and the lower surface of the film and the friction force existent between the film and the substrate; and then preparing the micro-nano structure on the hardened flexible film by using the micro-nano processing technology; and finally taking down the flexible film with the high-precision micro-nano structure on the surface from a hard substrate. Compared with the existing processing method, the problem that the stressed flexible film is easy to deform and cannot be closely laminated on a mask in the micro-nano processingprocedure is solved, the line width precision and the location precision of the micro-nano structure are greatly improved, and the high-precision preparation of the micro-nano structure on the flexible film substrate is realized.

Description

technical field [0001] The invention belongs to the technical field of micro-nano processing, and in particular relates to a high-precision preparation method of micro-nano structures on a flexible film substrate. Background technique [0002] Flexible film materials such as polyimide, polyethylene naphthalate, cellulose triacetate, polyvinyl alcohol, polyethersulfone, polyetheretherketone, polyamideimide, modified cyclic polyolefin, etc. It has the advantages of light weight, bendability, high chemical inertness, good optical performance, and low cost, so it is widely used as a substrate material in the field of micro-nano processing technology. [0003] However, due to the existence of problems such as the flexible film is easily deformed by force and not tightly attached to the mask during the micro-nano processing process, the micro-nano structure of the flexible film substrate prepared by the prior art method has a large line width error. And position error, unable to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C3/00B81C1/00B82Y40/00
CPCB81C1/0065B81C3/001B82Y40/00
Inventor 刘鑫李敏范斌
Owner INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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