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A high-precision preparation method of micro-nano structures on flexible film substrates

A technology of micro-nano structure and flexible film, which is applied in the direction of micro-structure technology, micro-structure device, processing micro-structure device, etc., and can solve problems such as loose mask bonding and deformation of flexible film

Active Publication Date: 2020-10-23
INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with the existing processing methods, this method solves the problems that the flexible film is easily deformed by force and not tightly attached to the mask during the micro-nano processing process, so that the line width accuracy and position accuracy of the micro-nano structure are greatly improved. Realized the high-precision preparation of micro-nanostructures on flexible film substrates

Method used

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  • A high-precision preparation method of micro-nano structures on flexible film substrates
  • A high-precision preparation method of micro-nano structures on flexible film substrates

Examples

Experimental program
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Effect test

example 1

[0031] like figure 1 As shown in 1-1, the upper surface edge of a quartz substrate 1 (size φ500mm*5mm) with high flatness (PV=200nm, RMS=50nm) is thinned by 0.5mm in the range from φ440mm to φ500mm to form a relatively A belt with a reduced height at the center;

[0032] like figure 1 As shown in 1-2, apply the adhesive polyurethane 2 evenly on the inner side of the thinning annulus (range φ450mm to φ470mm) with a brush, leaving a 5mm gap with the quartz boss to avoid the adhesive Squeezed to the upper surface of the boss;

[0033] like figure 1 As shown in 1-3, place an annular silicone rubber sealing ring 3 with a size of φ(480~490)mm*0.5mm on the outside of the adhesive polyurethane, and the outer edge of the sealing ring should not exceed the scope of the quartz substrate 1;

[0034] like figure 1 As shown in 1-4, the flexible polyimide film 5 is fixed by two aluminum fixtures, an upper fixture 4 and a lower fixture 6, and is placed in a sealed cavity together with th...

example 2

[0043] like figure 2 As shown in 2-1, the upper surface edge of a circular carbon fiber substrate 11 (dimension φ500mm*10mm) with high flatness (PV=4um, RMS=1um) is thinned by 1mm in the range from φ440mm to φ500mm to form a phase. The belt has a height lower than the center position;

[0044] like figure 2 As shown in 2-2, apply the adhesive polyurethane 2 evenly on the inner side of the thinning annulus (range φ450mm to φ470mm) with a brush, leaving a 5mm gap with the boss of the carbon fiber base to avoid glue. The adhesive is squeezed to the upper surface of the boss;

[0045] like figure 2 As shown in 2-3, place an annular silicone rubber sealing ring 3 with a size of φ(480~490)mm*0.5mm on the outside of the adhesive polyurethane, and the outer edge of the sealing ring should not exceed the scope of the carbon fiber substrate 1;

[0046] like figure 2 As shown in 2-4, the flexible polyimide film 5 is fixed by two aluminum fixtures, an upper fixture 4 and a lower ...

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Abstract

The invention discloses a high-precise preparation method of a micro-nano structure on flexible a film substrate. The preparation method comprises the following steps: firstly closely laminating a tightened flexible film on a hard material substrate surface with high flatness in a gapless way to realize an aim of hardening the flexible film, wherein the stressed flexible film is not prone to produce deformation due to the pressure differential between the upper surface and the lower surface of the film and the friction force existent between the film and the substrate; and then preparing the micro-nano structure on the hardened flexible film by using the micro-nano processing technology; and finally taking down the flexible film with the high-precision micro-nano structure on the surface from a hard substrate. Compared with the existing processing method, the problem that the stressed flexible film is easy to deform and cannot be closely laminated on a mask in the micro-nano processingprocedure is solved, the line width precision and the location precision of the micro-nano structure are greatly improved, and the high-precision preparation of the micro-nano structure on the flexible film substrate is realized.

Description

technical field [0001] The invention belongs to the technical field of micro-nano processing, and in particular relates to a high-precision preparation method of a micro-nano structure on a flexible film substrate. Background technique [0002] Flexible film materials such as polyimide, polyethylene naphthalate, cellulose triacetate, polyvinyl alcohol, polyethersulfone, polyetheretherketone, polyamideimide, modified cyclic polyolefin, etc., It has the advantages of light weight, bendability, high chemical inertness, good optical properties, and low cost, so it is widely used in the field of micro-nano processing technology as a base material. [0003] However, due to the existence of problems such as the flexible film is easily deformed by force during the micro-nano processing, and is not tightly attached to the mask, the micro-nano structures of the flexible film substrate prepared by the prior art methods have large line width errors. And position error, can not meet the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C3/00B81C1/00B82Y40/00
CPCB81C1/0065B81C3/001B82Y40/00
Inventor 刘鑫李敏范斌
Owner INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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