Strain measuring method based on SEM in-situ imaging system

Abstract

The invention discloses a strain measuring method based on an SEM in-situ imaging system. The method comprises the following steps: generating a series of randomly distributed points by using computersoftware, and simulating a speckle pattern; machining a sample, sanding the cut sample, polishing and washing; performing speckle preparation: based on the generated simulation speckle pattern, preparing micro-nano speckles on the surface of the sample by using a photoetch technology; finding out a speckle area by using the SEM in-situ imaging system, and shooting an image of the undeformed sample; performing a tensile test on the sample in a testing machine; finding out the speckle area by using the SEM in-situ imaging system, and shooting an image of the deformed sample; and performing digital image correlation analysis on the images before and after the sample deformation in combination with the computer software, to obtain a strain field of a sample shooting area. The method is high in precision, convenient to operate, and capable of realizing the non-contact measurement and the full-field measurement, wherein the dimension is calculated in nanometer level.

Description

technical field [0001] The invention relates to a micro-nano-scale DIC (Digital Image Correlation) strain measurement method, which belongs to the field of strain measurement. Background technique [0002] Material technology is an important part of future high-tech. With the advancement of science and technology and the deepening of people's understanding of matter, the observation of objects at the macro level can no longer meet the needs of people's understanding of matter, and the measurement of material deformation in microscopic form is becoming more and more received a lot of attention from people. The material analysis method at the microscopic scale is one of the important experimental methods in material science. Therefore, the material analysis method at the microscopic scale has important significance and effects on people's cognition of matter. [0003] The traditional strain measurement method, such as the electrical measurement method, uses the resistance str...

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Problems solved by technology

[0004] There are few existing methods for measuring the deformation of materials at the microscopic scale. Therefore, a strain measurement technology is required to analyze the microscopic deformation of materials. It requires high precision and easy operation. It can realize non-contact measurement, full-field measurement, and the scale is accurate to the nanometer level. , to ensure the measurement of the microscopic strain of the material, and then analyze the deformation behavior and law of the material on the microstructural scale

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