Method for preparing copper metal nanopowder having uniform oxygen passivation layer by using thermal plasma, and apparatus for preparing same

A metal powder and powder technology, which is applied in the field of preparing copper metal nano-powder with a uniform oxygen passivation layer by using thermal plasma and its preparation equipment, can solve the problems of high purity limitation, difficulty and the like

Active Publication Date: 2018-09-28
POONGSAN HLDG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, the prior art has limitations in achieving high purity by thermal plasma of high-melting point metals and difficulties in stably guaranteeing copper nanopowders with a controlled oxygen passivation layer as the main element of photo-sintering

Method used

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  • Method for preparing copper metal nanopowder having uniform oxygen passivation layer by using thermal plasma, and apparatus for preparing same
  • Method for preparing copper metal nanopowder having uniform oxygen passivation layer by using thermal plasma, and apparatus for preparing same
  • Method for preparing copper metal nanopowder having uniform oxygen passivation layer by using thermal plasma, and apparatus for preparing same

Examples

Experimental program
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Effect test

example 1

[0052] Copper powder having an average particle diameter of 12 μm and a purity of 96% was supplied into the plasma high temperature region by a raw material supplier at an injection rate of 0.5 kg / hr. Treatment with RF thermal plasma with 4MHz high-frequency power supply frequency, such as figure 1 As shown in , the raw material powder is melted due to thermal plasma. Under the condition that the amount of oxygen added is 1 slpm for 1 kg of copper or copper alloy powder injected per hour, oxygen passes through the oxygen reaction area to form a surface oxygen passivation layer. Afterwards, the oxygen that has passed through the reaction vessel to generate powder and the nano-copper metal powder that has been uniformly passivated by oxygen are collected by the collector. As a result, nano copper metal powder having an average particle diameter of 79 nm and an oxygen passivation layer having a thickness of 10 to 15 nm was prepared.

example 2

[0054] Nano copper metal powder having an average particle diameter of 98 nm and an oxygen passivation layer with a thickness of 8 to 10 nm was prepared in the same manner as Example 1 except that the injection rate of the copper powder was 0.9 kg / hr.

example 3

[0056] Nano copper metal powder having an average particle diameter of 120 nm and an oxygen passivation layer thickness of 5 to 8 nm was prepared in the same manner as Example 1 except that the injection rate of the copper powder was 1.2 kg / hr.

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Abstract

The present invention relates to a method for preparing a copper metal nanopowder having a uniform oxygen passivation layer by using a thermal plasma, and an apparatus for preparing the same and, morespecifically, to: a method for preparing a copper metal nanopowder for light sintering, having an average diameter of 50-200 nm and an average thickness, of a surface oxygen passivation layer, of 1-30 nm, by allowing copper or a copper alloy powder, which has an average diameter of 5-30 [mu]m, to pass through a thermal plasma torch, a reaction container and an oxygen reaction zone, wherein the copper or the copper alloy powder is injected at an injection rate of 0.5-7 kg / hr and the amount of oxygen to be added to the oxygen reaction zone, per kg of the copper or the copper alloy powder to beinjected per hour, is in the range of 0.3-12 standard liters per minute (slpm); and a light sintering copper metal nanopowder preparation apparatus for preparing the same.

Description

technical field [0001] Embodiments relate to a method of preparing copper nano metal powder having a uniform oxygen passivation layer by using thermal plasma and an apparatus for preparing the same. Background technique [0002] Printed electronics is the field of manufacturing electronic devices, components, and modules by printing methods, and is used to manufacture products with required functions by printing conductive ink on plastic or paper, and is widely used in almost all applications that use semiconductors, components, circuits, etc. areas such as conventional radio frequency identification (RFID) tags, lighting, displays, solar cells and battery packs. [0003] The fact that a killer application has not been developed in the printed electronics industry is mainly due to the very expensive price of silver inks and pastes used for most electrode materials. [0004] Attempts have been made to use less expensive nano-metal particles, such as copper powder, as electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/04B22F1/054B22F1/145
CPCB22F9/04B22F2999/00C22C9/00B22F1/145B22F1/054B22F1/056B22F2202/13A44C1/00A44C17/02A44C17/04A44B9/02A44B9/16A44D2200/10B22F2301/10B22F2304/054
Inventor 金大铉赵闰柱
Owner POONGSAN HLDG CORP
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