Method for preparing dry bonded structure surface through direct metal laser ablation
A structured surface, laser direct technology, used in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of high-cost manufacturing process, low output, dislocation, etc., achieve good metal properties, wide selectivity, avoid destabilizing effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0027] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.
[0028] Such as figure 1 As shown, the invention provides a method for laser direct etching of metal to prepare dry bonded structure surface, specifically comprising the following steps:
[0029] (1) Material preparation: the materials include metal substrate 1 and metal foil 2; the materials of metal substrate 1 and metal foil 2 are stainless steel, copper alloy or aluminum alloy, etc. (the two can be made of different materials); the metal substrate is required The surface roughness Ra values of 1 and metal foil 2 are both less than 3.2 μm, the thickness of metal substrate 1 is greater than 1 mm, and the thickness range of metal foil 2 is 0.002 mm to 0.2 mm; metal foil 2 is required to be flexible, and the surface shape of metal substrate 1 is The expandable surface, that is, the metal foil 2 can fit and cover the pattern area of ...
PUM
Property | Measurement | Unit |
---|---|---|
Surface roughness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com