Coating composition for ceramic matrix surface metallization

A surface metal and ceramic substrate technology, applied in the field of ceramic metallization, can solve the problems of easy falling off, poor thermal shock resistance, etc., and achieve the effects of not easy falling off, good welding performance and stable network structure

Inactive Publication Date: 2018-10-12
JIANGSU TIANZIGE NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention solves the technical problem that the metallized layer formed on the surface of the ceramic substrate by the ceramic substrate metallization coating composition in the prior art has poor thermal shock resistance and is easy to fall off

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0017] (1) Prepare coating: by mass percentage Cu:83.5wt%; Ti:4.5wt%; TiC:12wt%, take the electrolytic copper powder of corresponding quality, titanium powder and TiC powder; Be 132 parts of pine oils by mass proportioning Alcohol; 20 parts of ethyl cellulose; 20 parts of boiled oil water; 10 parts of dibutyl phthalate; 2 parts of BYK-359 (Byk Chemicals); 2 parts of hydrogenated castor oil Weigh the corresponding coating composition by electromagnetic stirring Prepare oily solvent with heating. Electrolytic copper powder, titanium powder, TiC powder and oily solvent were mixed on a three-roll mill for 30 minutes at a solid content of 20 vol% to prepare a coating;

[0018] (2) The ceramic (aluminum nitride ceramic) component to be metallized is ultrasonically cleaned and dried;

[0019] (3) Apply the coating to the surface of the ceramic component to be metallized by screen printing process, the coating thickness is 100 μm, and dry the coated component at 90° C. for 30 minutes...

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PUM

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Abstract

The invention provides a coating composition for ceramic matrix surface metallization. The coating composition for ceramic matrix surface metallization comprises a component A and a component B, wherein the component A is selected from two or more than two of Cu, Al, Fe, Ni, Co, Zn, Ag, Au, Cd, Ti, Zr or Mg; the component B is selected from one or a plurality of ceramic, W, Mo or Cr. After the coating composition is used for carrying out metallization on a ceramic matrix, a formed metallization layer is excellent in thermal shock resistance, the surface is still good after 500 times, damage orfalling does not appear, whereas a current metallization layer falls off after dozens of times or two hundred times at most, and the binding force of a material and the ceramic matrix is strong.

Description

technical field [0001] The invention belongs to the technical field of ceramic metallization, in particular to a metallization coating composition on the surface of a ceramic substrate. Background technique [0002] Oxide ceramics or nitrides are widely used in the packaging of electronic circuits and power components. In the packaging process, the ceramic surface must be metallized first, that is, the ceramic surface is covered with a thin metal layer, and then it can be connected with other metal components using a welding process to form a whole. [0003] Traditional ceramic metallization methods are mainly (1) molybdenum-manganese method: sintering after directly coating molybdenum-manganese metal powder on the ceramic surface; this method has high sintering temperature and high cost, and the application of the process has certain limitations. Generally, it can only be used in alumina ceramics, and it is not suitable for zirconia and aluminum nitride ceramics. (2) HIC ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B41/88
CPCC04B41/51C04B41/009C04B41/88C04B35/00
Inventor 丁左宏
Owner JIANGSU TIANZIGE NEW MATERIAL TECH CO LTD
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