A laser processing method and device

A laser processing method and laser processing technology, which are applied to laser welding equipment, metal processing equipment, glass cutting devices, etc., can solve the problems of increasing raw material purchases, increasing production costs, and low yield, so as to save raw materials, increase profits, The effect of improving the yield rate

Inactive Publication Date: 2021-01-19
GUANGDONG ZHENGYE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing technology of laser cutting glass and slitting, when the cut non-strengthened glass is subjected to laser heating slitting, it is along the figure 1 The direction of the arrow shown is heated from bottom to top, and there is heat accumulation in this way (for heat accumulation, refer to figure 2 ), it is very easy to cause the problem of edge collapse, which leads to low yield and many defective products, which increases the purchase of raw materials and increases the production cost

Method used

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  • A laser processing method and device
  • A laser processing method and device
  • A laser processing method and device

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Experimental program
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Effect test

Embodiment 1

[0033] Please refer to the attached image 3 , the first embodiment provides a laser processing method, comprising steps:

[0034] S101 , cutting the glass to be processed to form a cutting track.

[0035] Trajectory cutting with an ultrafast laser.

[0036] S102 , performing laser heat treatment on the cutting track of the cut glass according to the preset scanning path, so that the cut glass is split under the action of the laser heat treatment.

[0037] Wherein, the laser used in the laser heat treatment of the glass is carbon dioxide laser.

[0038] It should be noted that when the laser heating splitting process is performed on the cut glass, the part of the surrounding remaining material that needs to be split is first irradiated with a carbon dioxide laser on the periphery, and then the inside of the glass is irradiated.

[0039] In one embodiment, preferably, the preset scanning path is a segmented and discontinuous jump scanning path. See Figure 4 , After heatin...

Embodiment 2

[0043] Such as Figure 5 As shown, Embodiment 2 of the present invention provides a laser processing method, which is further optimized on the basis of the technical solution provided in Embodiment 1. Explanations of terms that are the same as or corresponding to the above embodiments are not repeated here. Specifically include the following steps:

[0044] S201. Cut the glass to be processed to form a cutting track.

[0045] S202 , performing laser heat treatment on the cutting track of the cut glass according to the preset scanning path, so that the cut glass is split under the action of the laser heat treatment.

[0046] S203 , polishing and grinding the cut surface of the split glass, and grinding an arc chamfer.

[0047] Wherein, the grinding time of each glass is 6-8 seconds / piece.

[0048] Specifically, the glass sheet is placed on the receiving table of the glass grinding device, and then the cutting surface of the glass sheet is polished and ground by the grinding...

Embodiment 3

[0051] Such as Image 6 As shown, Embodiment 3 of the present invention provides a laser processing device, which specifically includes the following modules:

[0052] The carrier 31 is used to carry and transport the glass to be processed;

[0053] The cutting module 32 is arranged at the front end of the carrier 61 in the conveying direction and above the glass, for cutting the glass to form a cutting track;

[0054] The laser heating module 33 is arranged at the rear end of the cutting device 62, and is used to generate laser light, and perform laser heat treatment on the cutting track of the cut glass according to the preset scanning path, so that the cut glass can be heated during the laser heat treatment. The lobes under action.

[0055] Preferably, the preset scanning path is a jump scanning path with discontinuous segments.

[0056]Preferably, the laser used in the laser heat treatment of the glass is carbon dioxide laser.

[0057] Preferably, the laser processing ...

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Abstract

The embodiment of the invention discloses a laser processing method and device. The method comprises the steps that to-be-processed glass is cut to form a cutting trajectory; and the cutting trajectory of the cut glass is subjected to laser thermal treatment according to a preset scanning path, so that the cut glass cracks under the action of laser thermal treatment. According to the laser processing method and device provided by the embodiment of the invention, during laser heating and cracking, adsorption of the glass to a laser beam is sectional and not continuous, heat accumulation can beeffectively avoided, glass cracking is evenly conducted, and compared with a traditional machining process, the edge breakage problem is avoided, the rate of finished products of the glass can be greatly improved, and accordingly raw materials are saved, the production cost is reduced, and profits are improved.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of laser processing, in particular to a laser processing method and device. Background technique [0002] Glass is formed by melting sand and other chemicals together. A silicate-based non-metallic material that forms a continuous network structure during melting, and gradually increases in viscosity and hardens during cooling to cause it to crystallize. At present, glass is widely used in various fields of life, such as construction, electronic products and so on. [0003] In the existing process of laser cutting glass and slivers, when the cut non-strengthened glass is subjected to laser heating slivers, it is along the figure 1 The direction of the arrow shown is heated from bottom to top, and there is heat accumulation in this way (for heat accumulation, refer to figure 2 ), it is very easy to produce the problem of edge collapse, which leads to low yield and many defective ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/402B24B1/00B24B9/08C03B33/02
CPCB23K26/38B23K26/402B24B1/00B24B9/08C03B33/02Y02P40/57
Inventor 丁黎明张芙蓉张文娟张梦阳梅领亮徐地华
Owner GUANGDONG ZHENGYE TECH
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