Conductive composite film, ceramic coating method by using conductive composite film and device adopted by ceramic coating method
A composite film and ceramic technology, applied in the field of electronics, can solve the problems of large space occupation, easy detachment of film layer, thick film layer, etc., to achieve the effects of good product performance, improved coating efficiency, and simplified process steps
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Embodiment 1
[0040] A ceramic coating method, the details are as follows:
[0041] The coating device used in this coating method includes: a coating machine, a vacuum device, a fixture, a sandblasting machine and a cleaning machine. The coating machine, the fixture, the sandblasting machine and the cleaning machine are set independently of each other. It includes an A cavity and a B cavity, both of which are connected to the vacuuming device, and the B cavity is provided with a fixed part that drives the clamp to rotate. Here, the coating machine is a magnetron sputtering coating machine; the sandblasting machine is an automatic sandblasting machine; and the cleaning machine is an ultrasonic cleaning machine.
[0042] Above-mentioned ceramic coating method specifically comprises the following steps:
[0043] The pretreatment step is specifically: including sandblasting and cleaning. The sandblasting is specifically: using a sandblasting machine to spray alumina powder on the surface of t...
Embodiment 2
[0059] The difference between this embodiment and embodiment 1 lies in that: the first inactive metal layer and the second inactive metal layer are titanium layers, and the active metal layer is an aluminum layer. The thickness of each layer and the actual process of coating are the same as in Example 1.
[0060] The product performance that present embodiment obtains is the same as embodiment 1.
[0061] In addition, other inactive metals (copper, silver, etc.) can also be used in the first inactive metal layer and the second inactive metal layer, and other active metals (such as magnesium, potassium, etc.) can also be used in the active metal layer. etc.), and then slightly modify the coating parameters according to the actual situation to meet different needs.
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