Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Aluminum-silicon/aluminum-silicon carbide gradient composite material and preparation method thereof

A technology of aluminum silicon carbide and composite materials, which is applied in the field of composite materials, can solve the problems of thermal expansion coefficient matching of electronic packaging materials, incompetence of lightweight and airtight welding, decreased life, and increased failure rate of electronic devices, etc. Ease of processing, performance-tunable effects

Active Publication Date: 2021-01-08
CENT SOUTH UNIV
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development of modern electronic systems in the direction of miniaturization, light weight, high operating frequency, high power density, multi-function and high reliability, traditional electronic packaging materials are no longer competent in terms of thermal expansion coefficient matching, light weight and hermetic welding.
[0003] Studies have shown that the failure rate of electronic devices increases sharply with the increase of operating temperature: Basically, for every 10°C increase in operating temperature, the life of GaAs or Si semiconductor devices will decrease by one-third

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Aluminum-silicon/aluminum-silicon carbide gradient composite material and preparation method thereof
  • Aluminum-silicon/aluminum-silicon carbide gradient composite material and preparation method thereof
  • Aluminum-silicon/aluminum-silicon carbide gradient composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] The aluminum-silicon / aluminum-silicon carbide gradient composite material designed in this embodiment is composed of two layers of aluminum-silicon alloy layer and one layer of aluminum-silicon carbide composite material layer; wherein, the weight percentage of aluminum in the two layers of aluminum-silicon alloy layer 27% and 50% respectively, the volume percentage of aluminum in the aluminum silicon carbide composite material layer is 60%; the aluminum alloy layer containing 50% aluminum is located in the aluminum alloy layer containing 27% aluminum and aluminum silicon carbide composite between material layers to obtain a three-layer gradient structure of Al27%Si-Al50%Si-Al60%SiC composite material.

[0053] The specific steps for preparing the Al-Si / Al-SiC gradient composite material in this example are as follows:

[0054] (1) Select pure aluminum ingots and monocrystalline silicon ingots as raw materials, and mix the pure aluminum ingots and monocrystalline silico...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
sizeaaaaaaaaaa
densityaaaaaaaaaa
sizeaaaaaaaaaa
Login to View More

Abstract

The invention relates to an aluminum silicon / aluminum silicon carbide gradient composite material and a preparation method thereof. The aluminum silicon / aluminum silicon carbide gradient composite material is the gradient composite material composed of at least one aluminum silicon alloy layer and at least one aluminum silicon carbide composite material layer; wherein, by weight percentage, the aluminum silicon alloy layer contains 22-50% of silicon and the balance aluminum; by volume percentage, the aluminum silicon carbide composite material layer comprises 40-65% of silicon carbide and thebalance aluminum or aluminum alloy. The aluminum silicon / aluminum silicon carbide gradient composite material has the advantages of being high in thermal conductivity, high in mechanical strength, lowin density, controllable in performance, easy to process, low in cost, and high in comprehensive performance, the various indicator requirements of electronic packaging can be met, and the aluminum silicon / aluminum silicon carbide gradient composite material is especially suitable for the electronic packaging materials.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to an aluminum-silicon / aluminum-silicon carbide gradient composite material and a preparation method thereof. Background technique [0002] Electronic packaging materials are base materials used to carry electronic devices and their interconnections, and play the roles of mechanical support, sealing environment protection, signal transmission, heat dissipation and shielding. There are many types of electronic packaging materials. Traditional metal-based or ceramic electronic packaging materials mainly include Cu, Al, Ti, Kovar, W / Cu, Mo / Cu, Al / SiC, Al 2 o 3 , AlN, etc. With the development of modern electronic systems in the direction of miniaturization, light weight, high operating frequency, high power density, multi-function and high reliability, traditional electronic packaging materials are no longer competent in terms of thermal expansion coefficient matching, li...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B22F7/02B22F3/14B22F3/15C22C1/05
CPCB22F3/14B22F3/15B22F7/02B22F2998/10C22C1/05B22F3/02
Inventor 蔡志勇王日初彭超群冯艳
Owner CENT SOUTH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products