Thermosetting conductive adhesive and preparation method thereof

A thermosetting, conductive adhesive technology, applied in conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve the problems of inconvenient storage and use of thermosetting conductive adhesives, and achieve the effect of superior electrical conductivity, convenient storage and use

Active Publication Date: 2018-11-06
佛山市瑞纳新材科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problem of inconvenient storage and use of existing thermosetting conductive adhesives, the purpose of the present invention is to pro

Method used

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Examples

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Example Embodiment

[0038] The invention also provides a preparation method of the thermosetting conductive adhesive, which includes the following steps:

[0039] A. Take 38-63% by weight of conductive filler and 5-15% by weight of thermosetting resin and mix, stir and mix uniformly to obtain composition A;

[0040] B. Take the nano silver crosslinking agent and mix it with the remaining conductive filler and thermosetting resin; stir and mix evenly to obtain composition B;

[0041] C. Mix composition A and composition B uniformly to obtain.

[0042] Further, the preparation method of the solid conductive adhesive includes the following steps:

[0043] A. Take 38-63% by weight of conductive filler and 5-15% by weight of thermosetting resin and mix, then add 38-63% by weight of volatile organic compounds, stir and mix uniformly to obtain composition A;

[0044] B. Take the nano silver crosslinking agent and mix it with the remaining conductive filler and thermosetting resin; then add the remaining volatile o...

Example Embodiment

[0047] Example 1:

[0048] A preparation method of solid conductive adhesive includes the following steps:

[0049] A. Take 35g of silver flake powder with a particle size of 1-5um and 14g of silver flake powder with a particle size of 5-10um into 15g of epoxy modified acrylic resin, dilute with 5g of reactive diluent butyl acrylate, and stir mechanically 30-60min, then roll three times with a three-roll mill to obtain component A;

[0050] B. Take 21g of silver powder with a particle size of 100-300nm and 1g of a nano silver crosslinking agent with a particle size of 10nm. The surface of the nano silver crosslinking agent contains a molecular structure of NH 2 -(CH 2 -CH 2 -O) n -CH 2 NH 2 , A low molecular weight oligomer with an average molecular weight of 200g / mol, mixed into 5g epoxy modified acrylic resin, diluted with 4g reactive diluent butyl acrylate, mechanically stirred for 30-60min, and then rolled with a three-roller Then use high-speed high-speed shearing machine and s...

Example Embodiment

[0055] Example 2:

[0056] A. Take 14g of silver flake powder with a particle size of 1-5um and 49g of silver flake powder with a particle size of 5-10um into 15g of epoxy-modified acrylic resin and dilute with 6g of reactive diluent butyl methacrylate, Stir mechanically for 30-60 minutes, then roll it three times with a three-roll mill to obtain component A;

[0057] B. Take 7g of silver powder with a particle size of 100-300nm and 1g of a nano-silver crosslinking agent with a particle size of 10nm. The surface of the nano-silver crosslinking agent contains a molecular structure of HOOC-(CH 2 -CH 2 ) n -COOH, a low molecular weight oligomer with an average molecular weight of 400g / mol, mixed into 5g epoxy modified acrylic resin, diluted with 3g reactive diluent butyl methacrylate, mechanically stirred for 30-60min, followed by three rolls Roll the machine three times, and then use a high-speed high-speed shearing machine and a sand mill to continue to disperse for 5-15 minutes to ...

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Abstract

The invention discloses a thermosetting conductive adhesive. The thermosetting conductive adhesive comprises, by weight, 50-70% of a conductive filler, 1-20% of a thermosetting resin, 0-20% of volatile organic compound and 1-30% of a nano-silver cross-linking agent. The nano-silver cross-linking agent comprises nano-silver particles with the sizes of 1-100mm and oligomers are adsorbed onto the surfaces of the nano-silver particles. The group at one end of the oligomer is selected from a carboxyl group, a mercapto group and an amino group and the group at the other end of the oligomer is selected from a carboxyl group, a mercapto group and an amino group. Two ends of the thermosetting resin contain reactive epoxy groups. The invention also provides a preparation method of the thermosettingconductive adhesive. The conductive adhesive has a stable system at the normal temperature, is easy to store, resists aging and has excellent electrical conductivity.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a thermosetting conductive adhesive, and also provides a preparation method of the thermosetting conductive adhesive. Background technique [0002] Conductive adhesive is an adhesive with certain conductivity after curing or drying. It can connect various conductive materials together to form a conductive path between the connected materials. It is usually prepared by dispersing conductive fillers such as gold powder, silver powder, copper powder, etc. in a resin carrier. In the electronic industry, conductive adhesive has become an essential new material. [0003] The conductivity of conductive glue comes from the contact conduction and electron tunneling between conductive particles. The stable contact between the particles in the adhesive layer is caused by the curing or drying of the conductive adhesive. Before the conductive adhesive is cured or dried, the conductive particles ex...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J163/00C09J133/04C09J175/04C09J161/14C09J183/06
CPCC09J9/02C09J133/04C09J161/14C09J163/00C09J175/04C09J183/06
Inventor 周虎高峰陈法波
Owner 佛山市瑞纳新材科技有限公司
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