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Thermosetting conductive adhesive and preparation method thereof

A thermosetting, conductive adhesive technology, applied in conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve the problems of inconvenient storage and use of thermosetting conductive adhesives, and achieve the effect of superior electrical conductivity, convenient storage and use

Active Publication Date: 2018-11-06
佛山市瑞纳新材科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problem of inconvenient storage and use of existing thermosetting conductive adhesives, the purpose of the present invention is to provide a conductive adhesive that can be stored and used at room temperature and has excellent heat resistance, aging resistance and electrical conductivity.

Method used

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preparation example Construction

[0038] The present invention also provides a preparation method of the thermosetting conductive adhesive, comprising the steps of:

[0039] A. Take the conductive filler of 38-63% by weight and mix it with the thermosetting resin of 5-15% by weight, stir and mix evenly to obtain composition A;

[0040] B. Take the nano-silver crosslinking agent and mix it with the remaining conductive filler and thermosetting resin; stir and mix evenly to obtain composition B;

[0041] C. Mix composition A and composition B evenly to get ready.

[0042] Further, the preparation method of the solidified conductive adhesive comprises the steps of:

[0043] A. Take the conductive filler that is 38-63% by weight and mix it with the thermosetting resin that is 5-15% by weight, then add the volatile organic compound that is 38-63% by weight, stir and mix evenly to obtain composition A;

[0044] B. Take the nano-silver crosslinking agent and mix it with the remaining conductive filler and thermoset...

Embodiment 1

[0048] A preparation method of solid conductive adhesive, comprising the steps of:

[0049] A. Mix 35g of silver flake powder with a particle size of 1-5um and 14g of silver flake powder with a particle size of 5-10um into 15g of epoxy-modified acrylic resin, dilute with 5g of active diluent butyl acrylate, and stir mechanically 30-60min, then rolled three times with a three-roll machine to obtain component A;

[0050] B. Get 21g of silver powder with a particle size of 100-300nm, and 1g of nano-silver cross-linking agent with a particle size of 10nm. The surface of this nano-silver cross-linking agent contains a molecular structure of NH 2 -(CH 2 -CH 2 -O) n -CH 2 NH 2 , a low molecular weight oligomer with an average molecular weight of 200g / mol, mixed in 5g of epoxy-modified acrylic resin, diluted with 4g of active diluent butyl acrylate, mechanically stirred for 30-60min, and then rolled three times with a three-roller machine and then continue to disperse for 5-15 m...

Embodiment 2

[0056] A. Mix 14g of silver flake powder with a particle size of 1-5um and 49g of silver flake powder with a particle size of 5-10um into 15g of epoxy-modified acrylic resin, dilute with 6g of active diluent butyl methacrylate, Stir mechanically for 30-60min, then roll three times with a three-roll machine to obtain component A;

[0057] B. get the silver powder of the particle diameter 100-300nm of 7g, the nano-silver cross-linking agent of the particle diameter 10nm of 1g, this nano-silver cross-linking agent surface contains molecular structure and is HOOC-(CH 2 -CH 2 ) n -COOH, a low-molecular-weight oligomer with an average molecular weight of 400g / mol, mixed into 5g of epoxy-modified acrylic resin, diluted with 3g of reactive diluent butyl methacrylate, mechanically stirred for 30-60min, and then mixed with three rollers Machine rolling three times, and then continue to disperse for 5-15 minutes with high-speed high-speed shearing machine and sand mill to obtain compon...

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Abstract

The invention discloses a thermosetting conductive adhesive. The thermosetting conductive adhesive comprises, by weight, 50-70% of a conductive filler, 1-20% of a thermosetting resin, 0-20% of volatile organic compound and 1-30% of a nano-silver cross-linking agent. The nano-silver cross-linking agent comprises nano-silver particles with the sizes of 1-100mm and oligomers are adsorbed onto the surfaces of the nano-silver particles. The group at one end of the oligomer is selected from a carboxyl group, a mercapto group and an amino group and the group at the other end of the oligomer is selected from a carboxyl group, a mercapto group and an amino group. Two ends of the thermosetting resin contain reactive epoxy groups. The invention also provides a preparation method of the thermosettingconductive adhesive. The conductive adhesive has a stable system at the normal temperature, is easy to store, resists aging and has excellent electrical conductivity.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a thermosetting conductive adhesive, and also provides a preparation method of the thermosetting conductive adhesive. Background technique [0002] Conductive adhesive is an adhesive with certain conductivity after curing or drying. It can connect various conductive materials together to form a conductive path between the connected materials. It is usually prepared by dispersing conductive fillers such as gold powder, silver powder, copper powder, etc. in a resin carrier. In the electronic industry, conductive adhesive has become an essential new material. [0003] The conductivity of conductive glue comes from the contact conduction and electron tunneling between conductive particles. The stable contact between the particles in the adhesive layer is caused by the curing or drying of the conductive adhesive. Before the conductive adhesive is cured or dried, the conductive particles ex...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J163/00C09J133/04C09J175/04C09J161/14C09J183/06
CPCC09J9/02C09J133/04C09J161/14C09J163/00C09J175/04C09J183/06
Inventor 周虎高峰陈法波
Owner 佛山市瑞纳新材科技有限公司
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