Palladium-silver slurry for chip varistor

A varistor, palladium silver technology, applied in varistors, overvoltage protection resistors, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problem of poor compatibility between slurry and porcelain body, technical performance and Low reliability, hard to find high-quality raw materials and other problems, to achieve the effect of strong ability to dissolve polymer resin, meet sintering compatibility, and low cost

Inactive Publication Date: 2018-11-06
广东海之源新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Palladium-silver paste is complicated and has high technical content. Domestic palladium-silver paste has low technical performance and reliability, poor compatibility between paste and porcelain body, raw materials and intermediate production technology are backward, and high-quality paste required Raw materials are difficult to find and other disadvantages; although foreign palladium silver pastes are of good quality, they are expensive, long delivery time, and untimely service

Method used

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  • Palladium-silver slurry for chip varistor
  • Palladium-silver slurry for chip varistor
  • Palladium-silver slurry for chip varistor

Examples

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Effect test

Embodiment 1

[0031] An embodiment of the palladium-silver paste for chip varistor of the present invention, the palladium-silver paste for chip varistor of this embodiment contains the following components by mass percentage:

[0032] Palladium silver powder 45%, organic carrier 25%, organic additive 0.5%, inorganic additive 5.0%, organic solvent 24.5%;

[0033] In the metal powder, the specific surface area of ​​the palladium-silver powder is 0.8m 2 / g.

[0034] The organic vehicle comprises: 90 parts of organic solvent (20 parts of isooctyl alcohol, 40 parts of terpineol, 10 parts of mineral spirits, 20 parts of diethylene glycol butyl ether acetate), and 10 parts of polymer resin (rosin resin 1 Part, ethyl cellulose 9 parts); the polymer resin is added to an organic solvent, stirred and dissolved at 70° C. for 2 hours to obtain the organic carrier.

[0035] The inorganic additives are ZnO, CuO, ZrO 2 , Al 2 O 3 And the particle size of the inorganic additive is not greater than 5 μm; the organi...

Embodiment 2

[0042] An embodiment of the palladium-silver paste for chip varistor of the present invention, the palladium-silver paste for chip varistor of this embodiment contains the following components by mass percentage:

[0043] Palladium silver powder 55%, organic carrier 30%, organic additive 1%, inorganic additive 2%, organic solvent 12%;

[0044] The specific surface area of ​​the palladium silver powder is 1.0m 2 / g.

[0045] The organic vehicle contains 87 parts of organic solvent (37 parts of isooctyl alcohol, 30 parts of terpineol, 10 parts of tetratoluene, 10 parts of mineral spirits), 13 parts of polymer resin (1 part of rosin resin, 10 parts of ethyl cellulose). Parts, acrylic resin 2 parts); the polymer resin is added to the organic solvent, and stirred and dissolved at 80° C. for 1.5 hours to obtain the organic carrier.

[0046] The inorganic additive is BaTiO 3 , BaO, SiO 2 , A mixture of MgO, and the particle size of the inorganic additive is not greater than 5 μm; the organic...

Embodiment 3

[0054] An embodiment of the palladium-silver paste for chip varistor of the present invention, the palladium-silver paste for chip varistor of this embodiment contains the following components by mass percentage:

[0055] Palladium silver powder 60%, organic carrier 22%, organic additive 1.5%, inorganic additive 2.5%, organic solvent 14%;

[0056] The specific surface area of ​​the palladium-silver powder is 1.6m 2 / g.

[0057] The organic vehicle comprises: 85 parts of organic solvent (30 parts of isooctyl alcohol, 10 parts of tetramethylbenzene, 35 parts of diethylene glycol butyl ether acetate, 10 parts of mineral spirits), 15 parts of polymer resin (2 parts of acrylic resin) , 13 parts of ethyl cellulose); adding the polymer resin to an organic solvent, stirring and dissolving at 90° C. for 1 hour to obtain the organic carrier.

[0058] The inorganic additive is ZrO 2 , Al 2 O 3 , BaTiO 3 , A mixture in BaO, and the particle size of the inorganic additive is not greater than 5 μm;...

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Abstract

The invention discloses palladium-silver slurry for a chip varistor. The palladium-silver slurry contains metal powder, wherein the metal power is palladium-silver powder; in the palladium-silver slurry, the mass percentage of the palladium-silver powder is 45 to 65 percent. The palladium-silver slurry is used in the chip varistor, and has the advantages of environment protection, good dispersionperformance, high stability, high reliability, good printing performance and the like; the obtained chip varistor has good performance. Compared with imported palladium-silver slurry, the palladium-silver slurry has the advantages that the green and environmental-friendly effects are achieved; the stability is good; the cost is low; relatively good application prospects are realized.

Description

Technical field [0001] The invention relates to a palladium-silver paste, in particular to a palladium-silver paste for chip varistors. Background technique [0002] The main function of the varistor is to detect and suppress the recurring surge voltage and overvoltage without destroying itself. It has excellent nonlinear volt-ampere characteristics and has a small leakage current under steady-state operating voltage. These characteristics are used to manufacture electronic protection devices such as overvoltage protection of various semiconductor devices, lightning surge protection of electronic equipment, and transient pulse suppression in various devices, which are widely used in electronic circuits of household appliances. [0003] Palladium-silver paste is also the most widely used electronic paste. The palladium-silver paste is mainly composed of three parts: functional phase, functional auxiliary and organic carrier. Palladium-silver pastes are complex and have high techni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/12H01B1/22
CPCH01C7/12H01B1/22
Inventor 胡愿防
Owner 广东海之源新材料科技有限公司
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