Processing method for preventing gold-seepage short circuit on solder resist lateral-erosion position of circuit board

Abstract

The invention discloses a processing method for preventing gold-seepage short circuit on the solder resist lateral-erosion position of a circuit board. The processing method comprises the steps that the early processes, such as cutting, of the circuit board are completed according to a conventional technology, and a solder resist is processed; and after the solder resist is processed, solder resist lateral-erosion between circuits of the circuit board is treated through laser drilling, and ink of solder resist lateral-erosion is carbonized and absorbed through laser. According to the processing method, solder resist lateral-erosion on the position of small-spacing nickel-gold immersion is effectively eliminated, the problem of gold seepage of the circuit board due to residue of potion is prevented, the product yield is effectively increased, reliability is effectively improved, thus the production cost is reduced, operation steps are easy, and operators are easy to learn and operate.

Description

technical field [0001] The invention relates to a method for processing the surface of a circuit board, in particular to a method for preventing a short circuit by gold penetration at a side corrosion position of a circuit board for resisting soldering. Background technique [0002] When the surface treatment of circuit boards is Immersion Nickel Gold or Nickel Palladium, when the distance between the positions of Immersion Nickel Gold is small, about 0.1mm, and part of the surface is covered with solder resist, it is very easy for the potion to remain on the edge of the solder resist The position of undercutting, during the surface treatment process of electroless nickel gold, the metal reacts and grows along the edge of the solder mask, resulting in a short circuit. The general practice in the industry is to control the processing conditions of the solder mask, reduce the amount of undercut of the solder mask, and reduce The reactivity of the immersion gold potion requires...

AI Technical Summary

Problems solved by technology

[0002] When the surface treatment of the circuit board is Immersion Nickel Gold or Nickel Palladium, when the distance between the positions of Immersion Nickel Gold is small, about 0.1mm, and part of the surface is covered with solder resist, it is very easy for the potion to remain on the edge of the solder resist The position of undercutting, during the surface treatment process of electroless nickel gold, the metal reacts and grows along the edge of the solder mask, resulting in a short circuit phenomenon. The general practice in the industry is to control the processing conditions of the solder mask, reduce the amount of side etching of the solder mask, and reduce Due to the reactivity of immersion gold potion, it is difficult to eliminate this problem by adding cleaning and equipment vibration, which will easily cause a large number of products to be short-circuited, scrapped or complained by customers, which will greatly increase production costs.

[0003] The industry needs to find a suitable treatment method to eliminate the undercut of the solder mask, so that the potion will not remain on the edge of the solder mask when the nickel-gold or nickel-palladium-gold is deposited, resulting in the metal along the resist during the process of surface treatment. Solder edge reaction growth, resulting in short circuit phenomenon