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A processing method for preventing short circuit of gold infiltration at side corrosion position of circuit board

A processing method and circuit board technology, which is applied to printed circuits, printed circuit manufacturing, and non-metallic protective layer coating, can solve problems such as increased cleaning, equipment vibration, product short-circuit scrapping, and increased production costs, so as to prevent circuit boards from The effect of gold infiltration problem, sufficient potion exchange, and effective elimination of solder mask side corrosion

Active Publication Date: 2020-07-03
HUIZHOU KING BROTHER CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When the surface treatment of the circuit board is Immersion Nickel Gold or Nickel Palladium, when the distance between the positions of Immersion Nickel Gold is small, about 0.1mm, and part of the surface is covered with solder resist, it is very easy for the potion to remain on the edge of the solder resist The position of undercutting, during the surface treatment process of electroless nickel gold, the metal reacts and grows along the edge of the solder mask, resulting in a short circuit phenomenon. The general practice in the industry is to control the processing conditions of the solder mask, reduce the amount of side etching of the solder mask, and reduce Due to the reactivity of immersion gold potion, it is difficult to eliminate this problem by adding cleaning and equipment vibration, which will easily cause a large number of products to be short-circuited, scrapped or complained by customers, which will greatly increase production costs.
[0003] The industry needs to find a suitable treatment method to eliminate the undercut of the solder mask, so that the potion will not remain on the edge of the solder mask when the nickel-gold or nickel-palladium-gold is deposited, resulting in the metal along the resist during the process of surface treatment. Solder edge reaction growth, resulting in short circuit phenomenon

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Preventive processing of gold infiltration and short circuit at the solder resist side corrosion position of the circuit board:

[0019] Step 1, complete pre-processes such as cutting of the circuit board according to the conventional process, and process the solder mask, and the distance between the lines of the circuit board is 0.1mm;

[0020] Step 2: After the solder resist processing, laser drilling is used to process the solder resist side erosion between the circuit board lines, where the laser wavelength is the wavelength of infrared light, the laser beam diameter is 50 μm, the aperture diameter is 1.5 mm, the processing power is 5000 V, and the pulse width is 3us, the frequency is 90Hz, and the number of pulses is 2 bursts;

[0021] Step 3, the laser carbonizes and sucks away the ink of the side etching of the solder mask;

[0022] Step 4, sinking nickel-gold or nickel-palladium-gold on the surface of the circuit board;

[0023] Step 5, completing post-process...

Embodiment 2

[0025] Preventive processing of gold infiltration and short circuit at the solder resist side corrosion position of the circuit board:

[0026] Step 1, complete the pre-processes such as cutting the circuit board according to the conventional process, and the distance between the lines of the circuit board is 0.1mm;

[0027] Step 2: After the solder resist processing, laser drilling is used to process the solder resist side erosion between the circuit board lines, where the laser wavelength is the infrared wavelength, the laser beam diameter is 200 μm, the aperture diameter is 1.8mm, the processing power is 5600V, and the pulse width is 4us, the frequency is 100Hz, and the number of pulses is 1 burst;

[0028] Step 3, the laser carbonizes and sucks away the ink of the side etching of the solder mask;

[0029] Step 4, sinking nickel-gold or nickel-palladium-gold on the surface of the circuit board;

[0030] Step 5, completing post-processes such as characters.

Embodiment 3

[0032] Preventive processing of gold infiltration and short circuit at the solder resist side corrosion position of the circuit board:

[0033] Step 1, complete the pre-processes such as cutting the circuit board according to the conventional process, and the distance between the lines of the circuit board is 0.15mm;

[0034] Step 2: After the solder resist processing, laser drilling is used to process the solder resist side erosion between the circuit board lines, where the laser wavelength is the infrared wavelength, the laser beam diameter is 300 μm, the aperture diameter is 2.0mm, the processing power is 5200V, and the pulse width is 3us, the frequency is 95Hz, and the number of pulses is 1 burst;

[0035] Step 3, the laser carbonizes and sucks away the ink of the side etching of the solder mask;

[0036] Step 4, sinking nickel-gold or nickel-palladium-gold on the surface of the circuit board;

[0037] Step 5, completing post-processes such as characters.

[0038] ...

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Abstract

The invention discloses a processing method for preventing gold-seepage short circuit on the solder resist lateral-erosion position of a circuit board. The processing method comprises the steps that the early processes, such as cutting, of the circuit board are completed according to a conventional technology, and a solder resist is processed; and after the solder resist is processed, solder resist lateral-erosion between circuits of the circuit board is treated through laser drilling, and ink of solder resist lateral-erosion is carbonized and absorbed through laser. According to the processing method, solder resist lateral-erosion on the position of small-spacing nickel-gold immersion is effectively eliminated, the problem of gold seepage of the circuit board due to residue of potion is prevented, the product yield is effectively increased, reliability is effectively improved, thus the production cost is reduced, operation steps are easy, and operators are easy to learn and operate.

Description

technical field [0001] The invention relates to a method for processing the surface of a circuit board, in particular to a method for preventing a short circuit by gold penetration at a side corrosion position of a circuit board for resisting soldering. Background technique [0002] When the surface treatment of circuit boards is Immersion Nickel Gold or Nickel Palladium, when the distance between the positions of Immersion Nickel Gold is small, about 0.1mm, and part of the surface is covered with solder resist, it is very easy for the potion to remain on the edge of the solder resist The position of undercutting, during the surface treatment process of electroless nickel gold, the metal reacts and grows along the edge of the solder mask, resulting in a short circuit. The general practice in the industry is to control the processing conditions of the solder mask, reduce the amount of undercut of the solder mask, and reduce The reactivity of the immersion gold potion requires...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28
CPCH05K3/28H05K3/282
Inventor 唐殿军李文浩樊廷慧
Owner HUIZHOU KING BROTHER CIRCUIT TECH