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Conductive film and conductive paste for laser etching processing

A technology of laser etching and conductivity, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, removal of conductive materials by discharge method, printed circuit, etc., can solve the problem of longer distance and reduce ring depressions, The movement of the solvent is smooth and the effect of suppressing the failure of the disconnection

Active Publication Date: 2018-11-09
TOYO TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, due to the increase in the size of the touch panel, the distance to remove the coating film by laser etching has also become longer, and the required performance of the conductive paste for laser etching has been increasing. Defective points caused by broken wires and short circuits have become a big problem, and we are looking for improvement

Method used

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  • Conductive film and conductive paste for laser etching processing
  • Conductive film and conductive paste for laser etching processing
  • Conductive film and conductive paste for laser etching processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3、 comparative example 1

[0189] According to the mixing ratio shown in Table 1, 4 kinds of conductive pastes were adjusted. First, the binder resin is dissolved in an appropriate amount of solvent so that the solid content concentration becomes 35% by mass, and the obtained binder resin solution, silver powder 1, curing agent, curing catalyst, and remaining solvent are weighed and added. , Other additives, after pre-mixing them, pass through the cooling three-roll mixer twice to disperse. Then, a filter of 795 mesh (stainless steel mesh filter (wire diameter 16 μm, mesh 16 μm)) was attached to a slurry filter (PF320A manufactured by Protech Co., Ltd.) to filter the slurry.

[0190] Then, the obtained conductive paste was printed in a predetermined pattern so that the dry film thickness would be 17 μm, and then dried at 120° C. for 30 minutes to obtain a conductive film. Basic physical properties were measured using the obtained conductive thin film, and then laser etching was studied. The evaluation...

Embodiment 11

[0233] According to the mixing ratio shown in Table 11, the electrically conductive paste was prepared. First, the binder resin is dissolved in an appropriate amount of solvent so that the solid content concentration becomes 35% by mass, and the obtained binder resin solution, silver powder 1, curing agent, curing catalyst, and remaining solvent are weighed and added. , Other additives, after pre-mixing them, pass through the cooling three-roll mixer twice to disperse. Then, a filter of 795 mesh (stainless steel mesh filter (wire diameter 16 μm, mesh 16 μm)) was attached to a slurry filter (PF320A manufactured by Protech Co., Ltd.) to filter the slurry. Then, after printing the obtained electroconductive paste in a predetermined pattern, it dried at 130 degreeC for 30 minutes, and obtained the electroconductive film. Basic physical properties were measured using this conductive film, and then laser etching was studied. The evaluation results are shown in Table 11.

Embodiment 12～21、 comparative example 11～13

[0235] The resin and formulation of the conductive paste were changed, and Examples 12-21 and Comparative Examples 11-13 were implemented. The formulation and evaluation results of the conductive paste are shown in Table 11. In the examples, good physical properties of the coating film can be obtained by heating in an oven at a relatively low temperature of 130° C. for 30 minutes for a short time. In addition, the evaluation after the adhesion to the ITO film and the heat-and-humidity environment test was also favorable.

[0236] Table 11

[0237]

[0238] Additionally, in Table 11,

[0239] Silver powder 1: Condensed silver powder (D50: 1.3μm)

[0240] Silver powder 2: flake silver powder (D50: 1.3μm)

[0241] Silver powder 3: Spherical silver powder (D50: 1.3μm)

[0242] Binder resin 1: PKHC manufactured by InChem (phenoxy resin, number average molecular weight 21000, Tg=89° C.)

[0243] Binder resin 2: PKHC modified product manufactured by Inchme (phenoxy resin, nu...

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Abstract

[Problem] To provide a conductive film which has excellent suitability for laser etching processing, capable of suppressing the occurrence of disconnect and short-circuits, even with difficult patterns such as narrow laser-etching width and long laser-etching distance. [Solution] Ring-shaped recess defects of the film surface are reduced using a conductive paste that contains at least: a polymer binder resin; a metal powder having an average particle diameter of 0.3 [mu]m to 6 [mu]m; and an organic solvent; and preferably silicon oxide or carbon particles having an average particle diameter of5 nm to 200 nm, and inorganic ion scavenger particles having a diameter of 50 nm to 3000 nm, whereby fine lines in which L / S = 50 / 50 [mu]m or less can be formed using laser etching.

Description

technical field [0001] The present invention relates to a production method capable of producing a conductive pattern having a high arrangement density in a planar direction, a conductive paste applicable to the production method, and a film (or thin film) made of the conductive paste. More specifically, the present invention relates to a conductive film that can be used to obtain a conductive pattern with a high arrangement density in the planar direction by removing a part of the conductive film (or conductive thin film) with an excitation light beam. Typically, the conductive pattern of the present invention can be used for electrode circuit wiring of a transparent touch panel. Background technique [0002] In recent years, the performance and miniaturization of electronic devices equipped with transparent touch panels represented by mobile phones, notebook computers, electronic books, etc. are rapidly progressing. In order to achieve high performance and miniaturization...

Claims

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Application Information

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IPC IPC(8): H05K1/09H01B1/22H05K3/08
CPCH01B1/22H05K1/09H05K3/08H05K1/095
Inventor 江口宪一坂本康博
Owner TOYO TOYOBO CO LTD
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