Low-dielectric resin composition, low-dielectric resin metal composite, preparation method of low-dielectric resin metal composite, and IT (internet) device

Abstract

The invention discloses a low-dielectric resin composition, a low-dielectric resin metal composite, a preparation method of the low-dielectric resin metal composite, and an IT (internet) device, wherein the low-dielectric resin composition comprises, based on 100% by weight, 45-70% of main resin, 20-45% of chopped glass fiber, 1-3% of toughened resin, 0.2-0.5% of non-modified glycidyl methacrylate, and 0-10% of aids; the main resin is selected from PBT (polybutylene terephthalate) resin and / or PPS (polyphenylene sulfite) resin; the chopped glass fiber has dielectric constant of 4.0-4.4 under 1MHz. A low-dielectric resin material made with the low-dielectric resin composition under the same main resin component has dielectric constant and dielectric loss both significantly reduced, which helps meet the requirement for metal-housing electronic equipment to use antenna channel plastics; therefore, capacities of an IT device antenna to receive and transmit signals are improved.

Description

technical field [0001] The invention relates to the field of resin-metal composite materials, in particular to a low-dielectric resin composition, a low-dielectric resin-metal composite material, a preparation method thereof, and IT equipment. Background technique [0002] In the manufacture of parts such as automobiles, home appliances, and industrial machines, it is necessary to firmly bond metal and resin. Nano Machining Technology (NMT) is an integrated combination technology of metal and plastic. By nano-processing the metal surface, the plastic can be directly injection-molded on the metal surface to obtain a metal-plastic integrated molding product. [0003] Glass fiber reinforced resins currently used in this nanofabrication process usually have high dielectric constant and dielectric loss. For some specially designed IT equipment, especially mobile phones, when the antenna slot on the back shell of the mobile phone is produced by nano-processing technology, the hig...

AI Technical Summary

Problems solved by technology

[0004] In order to meet the use requirements of the back shell of IT equipment such as mobile phones, researchers try to adjust the components of the resin composition to reduce the dielectric constant and dielectric loss of the corresponding resin material, but the effect is not ideal. Resin materials that meet the dielectric constant and dielectric loss will have poor mechanical properties or resin layer adhesion, while resin materials that can meet the mechanical properties and resin layer adhesion will have higher dielectric constant and dielectric loss

Images