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Diamond grinding wheel dressing method

A technology of diamond grinding wheel and electroplated diamond, which is applied in the direction of metal processing equipment, abrasive surface adjustment device, grinding machine tool parts, etc. It can solve the problems of low dressing accuracy, poor dressing effect, fast consumption, etc., and achieve good cutting effect , avoid excessive consumption, good effect

Inactive Publication Date: 2018-11-20
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Green silicon carbide grinding wheels of medium and soft grades (J, K, L hardness) are used to dress the grinding, but this dressing has the following problems: First, compared with diamond grinding wheels, silicon carbide grinding wheels have low hardness and fast consumption, and silicon carbide itself is damaged by diamonds. The grinding wheel wears off a lot of abrasive debris, and while extruding the diamond grinding wheel bond, it is also embedded in it, resulting in poor dressing effect
However, this method still has the disadvantage of low trimming accuracy

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The diamond grinding wheel dressing method of the present embodiment comprises the steps:

[0034] 1) Take the whole diamond grinding wheel to be dressed. The diamond grinding wheel to be repaired is a resin bonded diamond micropowder grinding wheel, and the particle size of diamond in the diamond grinding wheel to be repaired is 400 mesh, and the concentration is 75%. The diamond grinding wheel to be conditioned includes a base body of the grinding wheel to be conditioned, the base body of the grinding wheel to be conditioned is an annular disc, and a diamond abrasive layer is arranged on the outer peripheral surface of the annular disc. The angle α between the cutting surface of the outer peripheral surface of the diamond abrasive layer and the side surface of the diamond grinding wheel is 90°. The diameter of the grinding wheel to be trimmed is 10 mm, and the thickness is 10 mm.

[0035] Take the electroplated diamond grinding wheel. The particle size of the diamo...

Embodiment 2

[0043] The diamond grinding wheel dressing method of the present embodiment, as Figure 1-Figure 3 shown, including the following steps:

[0044] 1) Take the whole diamond grinding wheel to be dressed. The diamond grinding wheel to be repaired is a resin bond diamond micropowder grinding wheel, and the particle size of diamond in the diamond grinding wheel to be repaired is 600 mesh, and the concentration is 75%. The diamond grinding wheel to be conditioned includes a grinding wheel base 101 to be conditioned, which is an annular disk, and a diamond abrasive layer 102 is arranged on the outer peripheral surface of the annular disk. The angle α between the cut surface of the outer peripheral surface of the diamond abrasive layer and the side surface of the diamond grinding wheel is 75°. The diameter of the grinding wheel to be trimmed is 15mm and the thickness is 8mm.

[0045] Take the electroplated diamond grinding wheel. The particle size of the diamond abrasive in the el...

Embodiment 3

[0053] The diamond grinding wheel dressing method of the present embodiment comprises the steps:

[0054] 1) Take the whole diamond grinding wheel to be dressed. The diamond grinding wheel to be repaired is a resin bond diamond micropowder grinding wheel, and the particle size of diamond in the diamond grinding wheel to be repaired is 1000 mesh, and the concentration is 125%. The diamond grinding wheel to be conditioned includes a base body of the grinding wheel to be conditioned, the base body of the grinding wheel to be conditioned is an annular disc, and a diamond abrasive layer is arranged on the outer peripheral surface of the annular disc. The angle α between the cutting surface of the outer peripheral surface of the diamond abrasive layer and the side surface of the diamond grinding wheel is 45°. The diameter of the grinding wheel to be trimmed is 25mm, and the thickness is 25mm.

[0055] Take the electroplated diamond grinding wheel. The particle size of the diamond...

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Abstract

The invention relates to a diamond grinding wheel dressing method, and belongs to the technical field of grinding apparatuses. The diamond grinding wheel dressing method comprises the following stepsthat an electroplating diamond grinding wheel and a diamond grinding wheel to be dressed are relatively ground, then the relatively ground grinding wheel to be dressed is subjected to surface cleaning, and the diamond grinding wheel is obtained. According to the diamond grinding wheel dressing method, the diamond grinding wheel and the diamond grinding wheel are relatively ground, the diamond grinding wheel is dressed, and the problem that when a silicon carbide grinding wheel is used for dressing the diamond grinding wheel in the prior art, the silicon carbide grinding wheel is consumed too fast is avoided. Meanwhile, the diamond grinding wheel is adopted as the dressing grinding wheel, the shape retention performance is good, profile modeling dressing can be adopted for the diamond grinding wheel as the grinding wheel to be dressed, and the dressing precision of the diamond grinding wheel is improved.

Description

technical field [0001] The invention relates to a diamond grinding wheel dressing method, which belongs to the technical field of abrasive tools. Background technique [0002] Resin bonded diamond grinding wheel is a commonly used diamond grinding wheel. Among them, resin bonded ultrafine diamond powder grinding wheel is mostly used for polishing workpieces with high precision and high surface quality requirements, such as fine grinding of zirconia ceramic materials, sapphire materials, electronic components, etc. High-speed steel for devices, etc. Using this grinding wheel, generally the final polishing brightness can reach a mirror effect. [0003] During the grinding and polishing process, the grinding debris of the workpiece will accumulate in the resin bond ultra-fine diamond micropowder grinding wheel. Due to the blockage of the grinding debris, the diamond grinding wheel will lose its grinding and polishing ability, fail to achieve the polishing effect, and even caus...

Claims

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Application Information

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IPC IPC(8): B24B53/053B24B53/007B24B53/12
CPCB24B53/007B24B53/053B24B53/12
Inventor 叶腾飞王江涛熊华军
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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