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LED special-shaped heat dissipation substrate and preparation method and application thereof

A heat-dissipating substrate and special-shaped technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of poor heat dissipation of LED substrates, complex preparation process, poor heat dissipation effect, etc., to achieve stable LED operation, reduce junction temperature, The effect of improving the service life

Active Publication Date: 2018-11-23
INST OF CHEM CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0005] The purpose of the present invention is to overcome the poor heat dissipation of the LED substrate itself in the prior art, the existence of a large amount of chemical pollution in the process of process preparation and the complexity of the preparation process, and the heat dissipation effect is still not good after using an external heat sink on the LED substrate. To solve the problem, provide a LED special-shaped heat dissipation substrate and its preparation method and application. The LED special-shaped heat dissipation substrate has an integrally formed heat dissipation structure. Combined with the characteristics that its printing function adjustment layer is formed of high thermal conductivity inorganic materials, it double improves the LED substrate. Excellent heat dissipation, improving the service life of LED, at the same time, the preparation method also has the advantages of simple process and environmental friendliness

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  • LED special-shaped heat dissipation substrate and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] prepared as figure 1 The LED substrate shown: Prepare a non-flat aluminum plate with a size of 10cm×20cm as the non-flat heat dissipation metal layer 1. The lower surface of the aluminum plate extends vertically downward for 2cm in a sheet-like integrated molding structure, and the aluminum plate is treated with deionized water. After cleaning, the aluminum plate was placed in an anodic oxidation bath containing oxalic acid solution (concentration: 0.2 mol / L) for anodic oxidation treatment in a constant temperature bath at 10°C for 240 min to form an oxide layer 2 with a thickness of 20 μm.

[0069] The mixture of 5g containing the oxide of 60% by weight of phosphorus, the oxide of 20% by weight of boron and the oxide of 20% by weight of silicon is printed the function adjustment layer material by screen printing method, then it is put into muffle furnace, Heating at 500° C. for 40 minutes, and cooling to form a printed function adjustment layer 3 with a thickness of 10...

Embodiment 2

[0074] prepared as figure 1 The LED substrate shown: Prepare a non-flat aluminum alloy plate with a size of 10cm×20cm as the non-flat heat dissipation metal layer 1. Polishing was performed, and then the aluminum alloy plate was subjected to Na 3 PO 4 / NaOH electrolyte (concentration of 10.0 / 2.0g / L) for micro-arc oxidation treatment in a temperature-controlled micro-arc oxidation tank device, at a current density of 10.5A / dm 2 for 30 minutes to form an oxide layer 2 with a thickness of 15 μm.

[0075] Add 7.5g of a mixture of oxides containing 60% by weight of phosphorus, 30% by weight of alum and 10% by weight of barium to print the function adjustment layer material by screen printing, and then put it into the muffle furnace , heated at 450° C. for 25 minutes, and formed a printed function adjustment layer 3 with a thickness of 150 μm after cooling.

[0076] 5g contains 15% by weight of nano-silver powder (particle diameter is 30nm), 15% by weight of polyvinylpyrrolidone...

Embodiment 3

[0080] prepared as figure 1The LED substrate shown: Prepare a non-flat aluminum plate with a size of 10cm×20cm as the non-flat heat dissipation metal layer 1. The lower surface of the aluminum plate extends vertically downward for 2cm in a tooth-shaped integrally formed structure, and the aluminum plate is cleaned with ethanol solvent , and then put the aluminum plate in the Na 3 PO 4 / NaOH electrolyte (concentration of 10.0 / 2.0g / L) for micro-arc oxidation treatment in a temperature-controlled micro-arc oxidation tank device, at a current density of 10.5A / dm 2 It is carried out for 90 minutes to form an oxide layer 2 with a thickness of 35 μm.

[0081] A mixture of 2.5 g of oxides containing 55% by weight of boron, 25% by weight of barium and 20% by weight of zinc was printed on the function adjustment layer material by screen printing, and then it was put into the muffle furnace , heated at 570° C. for 35 minutes to form a printed function adjustment layer 3 with a thickne...

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Abstract

The invention relates to the technical field of an LED, and discloses an LED special-shaped heat dissipation substrate and a preparation method and an application thereof. The substrate comprises a non-flat-plate type heat dissipation metal layer, a printed function adjusting layer, a printed conductive layer and a protection layer which are sequentially stacked from bottom to top; the invention further discloses a method for preparing the LED special-shaped heat dissipation substrate; the method comprises the following steps: (1) providing a metal substrate with a non-flat-plate structure asthe non-flat-plate type heat dissipation metal layer, and forming an oxide layer optionally on the flat plate surface of the non-flat-plate type heat dissipation metal layer; (2) forming the printed function adjusting layer on the plate obtained in the step (1), and carrying out first heat treatment; (3) forming the printed conductive layer on the printed function adjusting layer which is subjected to heat treatment through printing, and then carrying out second heat treatment; and (4) forming the protection layer on the printed conductive layer which is subjected to heat treatment. Accordingto the LED special-shaped heat dissipation substrate, the heat dissipation performance of the LED substrate is double improved, the LED operation is stable, the service life is long, the preparation process is simple, and the environment-friendly effect is achieved.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a special-shaped heat dissipation substrate for LEDs and a preparation method and application thereof. Background technique [0002] After years of development, more and more LED technology has been applied to daily life, especially the application of LED lighting technology has become more and more diverse. Because of its energy saving, safety, long life, fast response and other characteristics, LED lighting has become the main force of the new generation of lighting. Among them, the market demand for high-power LEDs is also growing. However, because the light conversion efficiency of the LED itself is low, only 15-20%, a large amount of heat will be generated. Only when the heat is exported in time and quickly can the luminous efficiency and life of the LED be guaranteed. This requires that the LED substrate has better thermal conductivity, that is, better heat dissipation perfo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64
CPCH01L33/48H01L33/641H01L33/642H01L2933/0033H01L2933/0075
Inventor 张佑专张冕汪洋宋延林
Owner INST OF CHEM CHINESE ACAD OF SCI
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