Electromagnetic wave absorbing heat conducting sheet, method of manufacturing electromagnetic wave absorbing heat conducting sheet, and semiconductor device
A manufacturing method, electromagnetic wave technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problem of insufficient suppression of electromagnetic noise, and achieve excellent heat dissipation and electromagnetic wave suppression effects
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Embodiment 1
[0182] In Example 1, Fe-Si-B-Cr amorphous magnetic particles with an average particle diameter of 5 μm and pitch-based carbon fibers with an average fiber length of 200 μm (manufactured by "thermally conductive fiber" Japan Graphite Feiber Co., Ltd.) have a volume ratio of Two-component addition reaction liquid silicone: Amorphous magnetic particles: pitch-based carbon fiber = 35vol%: 53vol%: 12vol% dispersed in two-component addition reaction liquid silicone to prepare silicon Ketone composition (composition for sheet).
[0183] Two-component addition reaction liquid silicone is obtained by mixing silicone A liquid (main agent) and silicone B liquid (curing agent) at a ratio of 19:16. The obtained silicone composition was extruded into a cuboid mold of 30 mm×30 mm having a peeled PET film attached to the inner wall to form a silicone molded body. The obtained silicone molded body was cured in an oven at 100° C. for 6 hours to obtain a silicone cured product (molded body for ...
Embodiment 2
[0186] In Example 2, the above-mentioned silicone cured product was cut at a cut angle β: 75° (orientation angle α: 75°), to obtain a sample of an electromagnetic wave absorbing thermally conductive sheet having a thickness of 1 mm. Blending and other steps were made under the same conditions as in Example 1.
Embodiment 3
[0188] In Example 3, the above-mentioned silicone cured product was cut at a cut angle β: 60° (orientation angle α: 60°), to obtain a sample of an electromagnetic wave absorbing thermally conductive sheet having a thickness of 1 mm. Blending and other steps were made under the same conditions as in Example 1.
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