A ZnO/Si nano/micro column array sensitive material, a preparing method thereof and a sensor
An array sensor and sensitive material technology, applied in the direction of analyzing materials, material resistance, material analysis through electromagnetic means, etc., can solve problems such as poor quality of ZnO crystals, and achieve the effect of improving overall performance and sensitivity
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Embodiment 1
[0030] A preparation method of ZnO / Si nano / micro column array sensitive material, comprising the following steps:
[0031] (1) Preparation of Si nano / micro column array 11: Select a commercially available p-type Si single wafer with an X-ray rocking curve half width less than 50 arcsec and a resistance of less than 5Ω as the substrate 10, spin-coat photoresist on its surface, and use metal The plate is used as a mask plate for exposure, development, and ICP etching. The etching depth is 1000nm to obtain a Si nano / micro column array 11 with a diameter of 300nm and a distance of 50nm. figure 1 shown;
[0032] (2) using a PECVD process at 400°C to wrap a layer of 5nm ZnO film 12 on the surface of the Si nano / micro column array 11 prepared in step (1);
[0033] (3) Use a sputtering apparatus to coat a layer of 10nm Pt film on the surface of the ZnO thin film 12, then raise the temperature to 750°C at a heating rate of 50°C / min, and anneal for 40s to form on the surface of the ZnO...
Embodiment 2
[0036] A method for preparing a ZnO / Si nanometer / microcolumn array sensitive material, specifically comprising the following steps:
[0037] (1) Preparation of Si nano / micro column arrays: use a commercially available p-type Si single wafer with an X-ray rocking curve half-maximum width of less than 50arcsec and a resistance of less than 5Ω as a substrate, spin-coat photoresist on its surface, and use a metal plate as a substrate. The mask plate is exposed, developed, and etched by ICP to obtain a Si nano / micro column array, wherein the etching depth is 800nm, the diameter of the Si nano / micro column is 200nm, and the distance between them is 50nm;
[0038] (2) Using magnetron sputtering process at room temperature and vacuum pressure greater than 10 -3 The surface of the Si nano / micro column array prepared in step (1) is coated with a 10nm ZnO thin film under the environment of Pa, and then annealed at 500° C. for 30 min;
[0039] (3) Use a sputtering apparatus to coat a lay...
Embodiment 3
[0042] A method for preparing a ZnO / Si nanometer / microcolumn array sensitive material, specifically comprising the following steps:
[0043] (1) Preparation of Si nano / micro column arrays: select a commercially available p-type Si single wafer with an X-ray rocking curve half-maximum width of less than 50 arcsec and a resistance of less than 5Ω as the substrate, spin-coat photoresist on its surface, and use a metal plate as the substrate. The mask plate is exposed, developed, and etched by ICP to obtain a Si nano / micro column array, wherein the etching depth is 5000nm, the diameter of the Si nano / micro column is 1000nm, and the distance between them is 100nm;
[0044] (2) using the PECVD process at 400°C to wrap a layer of 5nm ZnO film on the surface of the Si nano / micro column array prepared in step (1);
[0045] (3) Use a sputtering apparatus to coat a layer of 10nm Au film on the surface of the above-mentioned ZnO film, then raise the temperature to 750°C at a heating rate ...
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