Preparation method for nanometer aluminum nitride powder

A nano-aluminum nitride and powder technology, which is applied in chemical instruments and methods, nitrogen compounds, nanotechnology, etc., can solve the problems of harsh reaction conditions, low product purity, and high raw material cost, and achieve good stability, high purity, and preparation The effect of simple method

Inactive Publication Date: 2018-12-18
SHAANXI NORMAL UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0013] The problem to be solved by the present invention is to provide a low-cost, simple preparation method and high product purity for the problems of high raw mat

Method used

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  • Preparation method for nanometer aluminum nitride powder
  • Preparation method for nanometer aluminum nitride powder
  • Preparation method for nanometer aluminum nitride powder

Examples

Experimental program
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Effect test

Embodiment 1

[0041] Grind and mix 2.1962g basic aluminum acetate and 6.1488g melamine evenly. The molar ratio of aluminum to melamine is 1:4. 2 It is calcined at 900°C for 3 hours. After cooling, it is decarburized at 600°C for 1 hour in an air atmosphere, and then cooled to obtain nano aluminum nitride powder.

[0042] by figure 1 It can be seen that the XRD diffraction peak of the synthesized aluminum nitride is completely consistent with the standard diffraction peak, without any other peaks, and the purity of the synthesized aluminum nitride on the surface is very high. The aluminum nitride crystal size calculated by the Scherrer formula at the diffraction peak position with a 2θ value of 50° is 17.54 nm, which is the average value of the crystal grain size in the vertical direction of 50° (102 crystal plane). From the electron microscope image, the average particle size of aluminum nitride particles can be obtained as 90nm (see Figure 2~4 ).

Embodiment 2

[0044] Grind and mix 2.1962g basic aluminum acetate and 6.1488g melamine evenly. The molar ratio of aluminum to melamine is 1:4. 2 Calcined at 800℃ for 4 hours, after cooling, perform decarburization treatment at 600℃ in air atmosphere for 1 hour, and cool to obtain nano aluminum nitride powder (see Figure 5 ).

Embodiment 3

[0046] Grind and mix 2.1962g basic aluminum acetate and 6.1488g melamine evenly. The molar ratio of aluminum to melamine is 1:4. 2 Calcined at 900℃ for 3 hours. After cooling, perform decarburization treatment at 700℃ in air atmosphere for 1 hour. Cool to obtain nano aluminum nitride powder (see Image 6 ).

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Abstract

The invention discloses a preparation method for nanometer aluminum nitride powder. The preparation method comprises the following steps: uniformly mixing a solid aluminum sourcesuch as aluminum nitrate, aluminum carbonate, aluminum isopropoxide, aluminum sulfate, aluminum acetate, basic aluminum acetate and alkaline aluminum acetate with a solid nitrogen source such as urea and melamine accordingto a molar ratio of elemental aluminum to the solid nitrogen source of 1: 1 to 1: 6; and carrying out calcining at 600 to 1000 DEG C for 1 to 6 h in a baking atmosphere; and then performing decarburization treatment in an air atmosphere at 300 to 650 DEG C for 1 to 4 h to obtain the high-purity aluminum nitride powder. The aluminum nitride powder prepared by using the method of the invention hashigh purity and a particle size distribution range of 15 to 90 nm; the preparation method is simple in process and easy to operate; the raw materials are widely available; synthesis cost is low; and the method is environmental friendly, economic and practicable and is a green process capable of realizing large-scale industrial production.

Description

Technical field [0001] The invention belongs to the technical field of nano material preparation, and specifically relates to a method for preparing nano aluminum nitride powder. Background technique [0002] As a new ceramic material with a hexagonal wurtzite structure, aluminum nitride has received extensive attention from researchers and industry in recent years. Aluminum nitride has high room temperature strength, high thermal conductivity (approximately 10 times that of alumina), low linear expansion coefficient, high resistivity, low dielectric constant, good insulation properties and thermal shock resistance. It can be used as high temperature And packaging materials for high-power devices. In addition, its high mechanical strength and thermal stability can be used as additives, reinforcing agents, catalyst carriers or catalytic materials for some composite materials. In short, aluminum nitride has broad application prospects in the electronics industry, high-temperature...

Claims

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Application Information

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IPC IPC(8): C01B21/072B82Y30/00
CPCB82Y30/00C01B21/072C01P2002/72C01P2004/03C01P2004/04C01P2004/64
Inventor 刘昭铁张琳陈建刚宋健刘忠文何珍红王宽
Owner SHAANXI NORMAL UNIV
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