Processing method for target materials to be processed

A processing method and target technology, applied in the field of semiconductor sputtering target manufacturing, can solve the problems of low recovery rate of waste targets and the like
CN109022792AActive Publication Date: 2018-12-18宁波创润新材料有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
宁波创润新材料有限公司
Publication Date
2018-12-18

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Abstract

The invention provides a processing method for target materials to be processed. The processing method comprises the steps that the target materials to be processed are provided; the target materialsto be processed are subjected to first acid pickling treatment through a first acid solution to form initial target materials, and the first acid solution and the target materials to be processed aresubjected to a first chemical reaction to remove part of materials on the surfaces of the target materials to be processed; and the initial target materials are subjected to second acid pickling treatment through a second acid solution, and the second acid solution and the initial target materials are subjected to a second chemical reaction to remove part of materials on the surfaces of the initial target materials, specifically, the rate of the second chemical reaction is smaller than the rate of the first chemical reaction. By means of the processing method, the recovery rate of the target materials to be processed can be increased.
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Description

technical field

[0001] The invention relates to the field of manufacturing semiconductor sputtering targets, in particular to a processing method for a target to be processed. Background technique

[0002] The target is also called a sputtering target, which is a sputtering source that forms various functional films on the substrate by sputtering under appropriate process conditions through magnetron sputtering, multi-arc ion plating or other types of coating systems. To put it simply, the target is the target material bombarded by high-speed energetic particles. It is used in high-energy laser weapons. When lasers with different power densities, different output waveforms, and different wavelengths interact with different targets, they will produce different damages. effect. Different film systems (such as superhard, wear-resistant, anti-corrosion alloy films, etc.) can be obtained by replacing different target materials (such as aluminum, copper, stainless steel, titanium...

Claims

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