A low-temperature quick-drying silver paste
A silver paste, low temperature technology, applied in conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of high-quality conductive silver paste preparation technology without major breakthroughs and dependence on imports.
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Embodiment 1-7
[0041]Embodiment 1-7: A kind of low-temperature fast-drying silver paste, the components contained and the corresponding content are shown in Table 1, wherein, the weight ratio of vinyl chloride acetate, polyester and C9 hydrogenated petroleum resin is 1:0.8:0.5 ; The silver particles are flaky and the particle size is 2.5-5 μm, and the bulk density is 1.2g / ml; the weight ratio of diethylene glycol ethyl ether acetate and DBE is 1:2.5; anti-sedimentation agent, defoamer, attached The weight ratio of the adhesion promoter to the thickener is 1:0.2:5:2, and the weight ratio of the silane coupling agent to the putty powder in the adhesion promoter is 0.1:3; the thickener is fumed silica.
[0042] Each component and its corresponding content (kg) in table 1 embodiment 1-7
[0043]
Embodiment 8
[0044] Embodiment 8: A low-temperature quick-drying silver paste. The difference from Embodiment 1 is that the weight ratio of vinyl chloride, polyester and C9 hydrogenated petroleum resin is 1:0.5:0.8.
Embodiment 9
[0045] Example 9: A low-temperature quick-drying silver paste, the difference from Example 1 is that the particle size of the silver particles is 2.5-5 μm, and the bulk density is 0.8 g / ml.
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