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A low-temperature quick-drying silver paste

A silver paste, low temperature technology, applied in conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of high-quality conductive silver paste preparation technology without major breakthroughs and dependence on imports.

Active Publication Date: 2020-07-07
深圳市璞瑞达薄膜开关技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of my country's conductive silver paste, including low-temperature curing conductive silver paste, still relies on imports, and the preparation technology of domestically produced high-quality conductive silver paste has not yet made a major breakthrough, and there will be more or less deficiencies

Method used

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  • A low-temperature quick-drying silver paste
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  • A low-temperature quick-drying silver paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-7

[0041]Embodiment 1-7: A kind of low-temperature fast-drying silver paste, the components contained and the corresponding content are shown in Table 1, wherein, the weight ratio of vinyl chloride acetate, polyester and C9 hydrogenated petroleum resin is 1:0.8:0.5 ; The silver particles are flaky and the particle size is 2.5-5 μm, and the bulk density is 1.2g / ml; the weight ratio of diethylene glycol ethyl ether acetate and DBE is 1:2.5; anti-sedimentation agent, defoamer, attached The weight ratio of the adhesion promoter to the thickener is 1:0.2:5:2, and the weight ratio of the silane coupling agent to the putty powder in the adhesion promoter is 0.1:3; the thickener is fumed silica.

[0042] Each component and its corresponding content (kg) in table 1 embodiment 1-7

[0043]

Embodiment 8

[0044] Embodiment 8: A low-temperature quick-drying silver paste. The difference from Embodiment 1 is that the weight ratio of vinyl chloride, polyester and C9 hydrogenated petroleum resin is 1:0.5:0.8.

Embodiment 9

[0045] Example 9: A low-temperature quick-drying silver paste, the difference from Example 1 is that the particle size of the silver particles is 2.5-5 μm, and the bulk density is 0.8 g / ml.

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Abstract

The invention discloses a low-temperature quick-drying silver paste, comprising the following components in parts by weight: polymer resin 15-25 part; Silver particles 65-85; Solvent 5-12; Additive 2-10 part; The polymer resin comprises vinyl chloride, polyester and C5 / C9 hydrogenated petroleum resin, and the weight ratio of vinyl chloride, polyester and C5 / C9 hydrogenated petroleum resin is 1: 0.5-1.1:1.8-2.2; The silver particles are in the form of flakes and have a particle size of 2.5-5 [mu] m, the bulk density is 0.8-1.8g / ml; The solvent comprises a weight ratio of 1: 1.5-3 diethylene glycol diethyl ether acetate and DBE. As that hydrogenate petroleum resin is added into the polymer resin, the overall viscosity and the oxidation resistance are improve, the integrity is higher, and thesolvent is diethylene glycol ethyl ether acetate and DBE, so that the resin is uniformly dissolved and dispersed, and the drying speed is fast, and the resin is favorable for production and construction.

Description

technical field [0001] The invention relates to the technical field of electronic connection materials, in particular to a low-temperature quick-drying silver paste. Background technique [0002] In recent years, with the rapid development of the electronics industry, the demand for products such as membrane switches, flexible printed circuit boards, electromagnetic shielding, potentiometers, and computer keyboards has also increased rapidly, and conductive silver paste is a key function in the preparation of such electronic components Materials, their development and application have also been widely concerned by people. However, most of my country's conductive silver paste, including low-temperature curing conductive silver paste, still relies on imports. The preparation technology of domestically produced high-quality conductive silver paste has not yet achieved major breakthroughs, and there will be more or less deficiencies. [0003] For example, the Chinese patent app...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22
CPCH01B1/22
Inventor 孔令海
Owner 深圳市璞瑞达薄膜开关技术有限公司