Sn-Cu-Ni lead-free solder containing Ga and Nd
A sn-cu-ni, lead-free solder technology, applied in the direction of welding/cutting media/materials, metal processing equipment, welding equipment, etc., can solve the problems of short circuit of electronic components and reduce the reliability of brazed joints, etc. Achieve the effect of uniform structure, inhibiting the growth of tin whiskers, and good wetting performance
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[0026] Example 1
[0027] The Sn-Cu-Ni lead-free solder containing Ga and Nd, in terms of mass percentage, includes: 0.45% Cu, 0.5% Ni, 0.003% As, 0.020% Sb, 0.4% Ga, 0.04% Nd , The balance is Sn. The mass ratio of Ga to Nd satisfies Ga:Nd=10:1.
[0028] The solidus temperature of the "Sn-Cu-Ni lead-free solder containing Ga and Nd" obtained from the above composition ratio is about 210°C, and the liquidus temperature is about 218°C (all considering the test error). With the commercially available RMA flux, it has excellent wetting properties on the copper plate, and the tensile strength of the brazing joint reaches 45MPa±5MPa.
[0029] image 3 After aging for 720 hours (30 days), there is no significant change in the intermetallic compound at the solder joint interface of the Sn-Cu-Ni lead-free solder containing Ga and Nd, and no tin whiskers sprout, indicating the reliability of the solder joint (solder) Sex has been significantly improved.
Example Embodiment
[0030] Example 2
[0031] Sn-Cu-Ni lead-free solder containing Ga and Nd, in terms of mass percentage: 1.1% Cu, 0.05% Ni, 0.008% As, 0.014% Sb, 0.6% Ga, 0.06% Nd , The balance is Sn. The mass ratio of Ga to Nd satisfies Ga:Nd=10:1.
[0032] The solidus temperature of the "Sn-Cu-Ni lead-free solder containing Ga and Nd" obtained from the above composition ratio is about 210°C, and the liquidus temperature is about 218°C (all considering the test error). With the commercially available RMA flux, it has excellent wetting properties on the copper plate, and the tensile strength of the brazing joint reaches 45MPa±5MPa.
[0033] image 3 After aging for 720 hours (30 days), there is no significant change in the intermetallic compound at the solder joint interface of the Sn-Cu-Ni lead-free solder containing Ga and Nd, and no tin whiskers sprout, indicating the reliability of the solder joint (solder) Sex has been significantly improved.
Example Embodiment
[0034] Example 3
[0035] Sn-Cu-Ni lead-free solder containing Ga and Nd, in terms of mass percentage: 0.7% Cu, 0.15% Ni, 0.005% As, 0.016% Sb, 0.5% Ga, 0.05% Nd , The balance is Sn. The mass ratio of Ga to Nd satisfies Ga:Nd=10:1.
[0036] The solidus temperature of the "Sn-Cu-Ni lead-free solder containing Ga and Nd" obtained from the above composition ratio is about 210°C, and the liquidus temperature is about 218°C (all considering the test error). With the commercially available RMA flux, it has excellent wetting properties on the copper plate, and the tensile strength of the brazing joint reaches 45MPa±5MPa.
[0037] image 3 After aging for 720 hours (30 days), there is no significant change in the intermetallic compound at the solder joint interface of the Sn-Cu-Ni lead-free solder containing Ga and Nd, and no tin whiskers sprout, indicating the reliability of the solder joint (solder) Sex has been significantly improved.
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