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Low-density nickel-plated hollow glass bead/polypropylene conductive composite material and preparing method thereof

A technology of hollow glass microspheres and conductive composite materials, which is applied in the field of polymers, can solve problems such as difficulty in utilizing hollow glass microspheres, lower density, and poor compatibility, and achieve the effects of reducing material costs, reducing density, and maintaining shape

Inactive Publication Date: 2019-01-04
重庆会通科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the shell wall of the hollow glass microsphere is thin, and it is easy to be crushed by strong shear during the screw processing, so it is difficult to exert the effect of the hollow glass microsphere to reduce the density. At the same time, the metallized glass microsphere has a smooth surface and poor compatibility with polypropylene. Therefore, the biggest challenge in the melt extrusion process is how to maintain the shape of the glass microspheres and achieve uniform dispersion in the polypropylene resin.

Method used

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  • Low-density nickel-plated hollow glass bead/polypropylene conductive composite material and preparing method thereof
  • Low-density nickel-plated hollow glass bead/polypropylene conductive composite material and preparing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0029] 1) Preparation of polypropylene composition: Weigh 57 parts of homopolypropylene, 30 parts of block copolymerized polypropylene, 3 parts of polypropylene grafted maleic anhydride, 0.2 parts of antioxidant 1010, 0.2 parts of antioxidant 168 part; 0.5 part of calcium stearate is added to a high-speed mixer and mixed evenly at high speed to obtain a polypropylene composition; wherein the mixing temperature is set at 30-50°C, and the rotating speed is 400-600 rpm;

[0030] 2) Preparation of nickel-plated hollow glass microsphere composition: add 10 parts of nickel-plated hollow glass microspheres; 1 part of 3-aminopropyltriethoxysilane into a high-mixer and mix evenly at a low speed to prepare nickel-plated hollow glass Microbead composition; wherein the mixing temperature is set at 40-60°C, and the rotation speed is 100-300 rpm;

[0031] 3) Preparation of low-density nickel-plated hollow glass microspheres / polypropylene conductive composite material: put the polypropylene ...

Embodiment 2

[0033] 1) Preparation of polypropylene composition: Weigh 45 parts of homopolypropylene, 35 parts of random copolymerized polypropylene, 5 parts of polypropylene grafted maleic anhydride; 0.1 part of antioxidant 1010, 0.1 part of antioxidant 168 1 part and 1 part of PE wax are added to a high-speed mixer and mixed evenly at high speed to obtain a polypropylene composition; the mixing temperature is set at 30-50°C, and the rotation speed is 400-600 rpm;

[0034] 2) Preparation of nickel-plated hollow glass microspheres composition: 15 parts of nickel-plated hollow glass microspheres; Mix evenly to obtain a nickel-plated hollow glass microsphere composition; wherein the mixing temperature is set at 40-60°C, and the rotating speed is 100-300 rpm;

[0035]3) Preparation of low-density nickel-plated hollow glass microspheres / polypropylene conductive composite material: put the polypropylene composition into the main feed of the co-rotating twin-screw extruder; The microbead compos...

Embodiment 3

[0037] 1) Preparation of polypropylene composition: Weigh 35 parts of block copolymerized polypropylene, 33 parts of random copolymerized polypropylene, 7 parts of polypropylene grafted maleic anhydride, 0.15 parts of antioxidant 1010, 168 parts of antioxidant Add 0.15 parts and 0.75 parts of PE wax into a high-speed mixer and mix evenly at high speed to prepare a polypropylene composition; the mixing temperature is set at 30-50°C, and the rotation speed is 400-600 rpm;

[0038] 2) Preparation of nickel-plated hollow glass microsphere composition: add 25 parts of nickel-plated hollow glass microspheres; 5 parts of 3-aminopropylmethyldiethoxysilane into a high-mixer and mix evenly at a low speed to obtain nickel-plated Hollow glass microsphere composition; wherein the mixing temperature is set at 40-60°C, and the rotating speed is 100-300 rpm;

[0039] 3) Preparation of low-density nickel-plated hollow glass microspheres / polypropylene conductive composite material: put the poly...

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Abstract

The invention discloses a low-density nickel-plated hollow glass bead / polypropylene conductive composite material and a preparing method thereof. The low-density nickel-plated hollow glass bead / polypropylene conductive composite material is composed of a polypropylene composition and a nickel-plated hollow glass bead composition; the polypropylene composition is prepared from, by weight, 68-87 parts of polypropylene, 3-7 parts of compatilizer, 0.2-0.4 part of antioxygen, 0.5-1 part of lubricating agent and 0-2 parts of other auxiliaries; the nickel-plated hollow glass bead composition is composed of 10-25 parts of nickel-plated hollow glass beads and 1-5 parts of silane coupling agent. According to the low-density nickel-plated hollow glass bead / polypropylene conductive composite materialand the preparing method thereof, the silane coupling agent is adopted for treating the surfaces of the nickel-plated hollow glass beads, the compatibility with polypropylene is enhanced, homogeneousdispersion of the nickel-plated hollow glass beads in resin is promoted, particles are in mutual contact to form a chain-like conductive channel, and thus a three-dimensional conductive path is formed.

Description

technical field [0001] The invention relates to the technical field of polymers, in particular to a low-density nickel-plated hollow glass microsphere / polypropylene conductive composite material and a preparation method thereof. Background technique [0002] Polypropylene (PP) has excellent mechanical properties, corrosion resistance, good processability, low price, and a resistivity of about 10 16 -10 18 Ω.cm is a kind of insulating material with excellent performance. With the rapid development of electronics industry, information technology and lightweight technology, polypropylene with low density and conductive function has become an important research direction in the field of polymer materials. Market demand It is also becoming more and more urgent. [0003] Conductive polypropylene material is prepared from conductive fillers (such as carbon black, carbon nanotubes, graphene and metal particles and polypropylene resin, and has a wide range of applications in electr...

Claims

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Application Information

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IPC IPC(8): C08L23/12C08L53/00C08L51/06C08L23/06C08K13/06C08K9/06C08K7/28C08K5/134C08K5/526C08K5/098B29C48/405B29C48/505B29C48/92
CPCC08K2201/001C08L23/12C08L2201/04C08L2205/03C08L2205/035C08L53/00C08L51/06C08K13/06C08K9/06C08K7/28C08K5/1345C08K5/526C08K5/098C08L23/06
Inventor 石阳阳方超李飞任大伟周海闫溥高勇李荣群
Owner 重庆会通科技有限公司