A packaging and testing system for a semiconductor indium antimonide Hall device

Abstract

The invention discloses a packaging and testing system for a semiconductor indium antimonide Hall device, which comprises a first plastic package and a second plastic package, a main channel is arranged between the first plastic package and the second plastic package, and the first plastic package A row of first holes are opened through the upper and lower end faces of the first plastic package and the second plastic package near the two sides, and the two rows of first holes are arranged parallel to each other. The first plastic package and the second plastic package are close to the two sides. There is a row of second holes through the upper and lower end faces of each side, the two rows of first holes and the corresponding two rows of second holes are linearly distributed, and the first holes and the second holes in the same row are in the form of Misalignment distribution. Several copper-based element groups are installed on the upper end surfaces of the first plastic package and the second plastic package. The present invention relates to a packaging and testing system for semiconductor indium antimonide Hall devices. This design adopts an 8-row automatic loading method , to ensure product consistency, this design automatic mold one mold 2 cavities 576Pcs, automatic mold mode 50 seconds, in terms of epoxy materials, this design saves 80% material waste compared with traditional ones.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging and manufacturing, in particular to a packaging and testing system for semiconductor indium antimonide Hall devices. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] The traditional lead frame adopts the traditional manual loading method for molding, 8 cavities per mold, 480Pcs of packaged products, and the production time of one mold in the traditional way is 3 minutes, and the efficiency is low. The...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a semiconductor indium antimonide Hall device packaging and testing system in order to solve the above problems, which solves the problems of low production efficiency and large loss of raw materials in the existing lead frame

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