Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sealing composition and semiconductor device

A technology of sealing composition and hydrotalcite compound, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as residues, and achieve the effect of excellent moisture resistance and reliability

Active Publication Date: 2019-01-15
RESONAC CORP
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy resins are often synthesized using epichlorohydrin, and in such sealing compositions containing epoxy resins, alkali residues derived from epoxy resins tend to remain as lead-wire corrosive impurities.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sealing composition and semiconductor device
  • Sealing composition and semiconductor device
  • Sealing composition and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0047] The sealing composition of the first embodiment includes an epoxy resin, a curing agent, an inorganic filler, and an unfired resin having a molar ratio of Mg ions to Al ions (Mg / Al, hereinafter also referred to as Mg / Al ratio) of 2.4 or more. Hydrotalcite compound (hereinafter also referred to as a first hydrotalcite compound). The sealing composition of the first embodiment may contain other components such as a curing accelerator.

[0048] The semiconductor device manufactured using the sealing composition of the first embodiment has excellent moisture resistance reliability in a state where a bias voltage is applied. The reason for this is not clear, but it is considered that the reason is that the Mg / Al ratio of the first hydrotalcite compound contained in the sealing composition of the first embodiment is 2.4 or more, and the hydrotalcite compound is sufficiently maintained without firing. In the layer structure of the hydroxide sheet, a sufficient ion trapping ef...

Embodiment 1A～4A

[0192] (Examples 1A to 4A and Comparative Examples 1A to 4A)

[0193] After pre-mixing (dry blending) the materials shown in Table 1, knead with a twin-axial roller (roller surface temperature: about 80°C) for about 15 minutes, cool and pulverize, and make a powder-like sealing combination thing.

[0194] About Example 1A and Comparative Example 1A, Example 2A and Comparative Example 2A, Example 3A and Comparative Example 3A, and Example 4A and Comparative Example 4A, the composition was the same except that the type of hydrotalcite was changed.

[0195] [Table 1]

[0196]

[0197] The details of the materials in Table 1 are as follows.

[0198] (epoxy resin)

[0199] E1: YSLV-80XY, trade name of Nippon Steel & Sumikin Chemical Co., Ltd.

[0200] E2: YX-4000, oil shell epoxy (Co., Ltd.) trade name

[0201] E3: HP-5000, DIC (Co., Ltd.) trade name

[0202] E4: CER-3000L, trade name of Nippon Kayaku Co., Ltd.

[0203] E5: YSLV-120TE, trade name of Nippon Steel & Sumikin...

Embodiment 5A、6A and comparative example 5-1A～5-3A

[0225] In the same manner as in the above-mentioned examples, a powdery sealing composition and a test piece were prepared using the blended materials shown in Table 3, and a HAST test was performed.

[0226] In Examples 5A and 6A and Comparative Examples 5-1A to 5-3A, unfired hydrotalcite compounds were used. In addition, in Examples 5A and 6A, hydrotalcite compounds having a Mg / Al ratio of 2.4 or more were used, and in Comparative Examples 5-1A to 5-3A, hydrotalcite compounds having a Mg / Al ratio of less than 2.4 were used.

[0227] [table 3]

[0228]

[0229] The details of the materials in Table 3 are as follows.

[0230] E1: YSLV-80XY, trade name of Nippon Steel & Sumikin Chemical Co., Ltd.

[0231] E2: YX-4000, oil shell epoxy (Co., Ltd.) trade name

[0232] H1: HE910, Air water Co., Ltd. product name

[0233] H2: HE200C, Air water Co., Ltd. product name

[0234] HA1: Triphenylphosphine

[0235] HT1: Mg / Al≈3.0, unfired form

[0236] HT3: Mg / Al≈0.6, unfired form...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
specific surface areaaaaaaaaaaa
Login to View More

Abstract

A first sealing composition according to the present invention contains an epoxy resin, a curing agent, an inorganic filler and an uncalcined hydrotalcite compound having a molar ratio of Mg ions to Al ions (Mg / Al) of 2.4 or more. A second sealing composition according to the present invention contains an epoxy resin, a curing agent, a hydrotalcite compound represented by general formula (1) Mg1-xAlx(OH)2(CO3)x / 2mH2O (wherein each of x and m independently represents a positive number), and a magnesium-containing compound that is different from the hydrotalcite compound. A third sealing composition according to the present invention contains an epoxy resin, a curing agent, a hydrotalcite compound represented by general formula (1), and magnesium oxide; and the content of the magnesium oxideis from 1 part by mass to 50 parts by mass relative to 100 parts by mass of the epoxy resin.

Description

technical field [0001] The present invention relates to a sealing composition and a semiconductor device. Background technique [0002] So far, the mainstream of semiconductor packages has been the package using gold as the lead material. In recent years, due to the rise in the price of gold, etc., the use of copper as the lead material has increased. On the other hand, as a sealing composition for sealing a semiconductor package, a sealing composition containing an epoxy resin is widely used. However, epoxy resins are often synthesized using epichlorohydrin, and in such sealing compositions containing epoxy resins, alkali residues derived from epoxy resins tend to remain as lead wire corrosive impurities. Copper is more chemically reactive than gold and therefore readily promotes alkali-based corrosion. Therefore, in order to improve the reliability of semiconductor packages using copper leads, attempts have been made to include a hydrotalcite compound as an ion trapping ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/22C08K3/26H01L23/29H01L23/31
CPCC08K3/22C08K3/26C08L63/00H01L23/29H01L23/31H01L23/295C08K2003/222C08L2203/206C08L2205/025C08L2205/03C08K2003/2227
Inventor 姜东哲堀江隆宏石桥健太生井直树关口和秀堀慧地
Owner RESONAC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com