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Self-adaption diamond-wire-saw cutting equipment

A technology of diamond wire saw and cutting equipment, which is applied in the field of precision cutting and diamond wire saw cutting equipment. It can solve the problems of difficult processing and difficult processing, and achieve the effects of simple structure, improved processing quality and compact equipment structure.

Active Publication Date: 2019-01-18
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the special physical and mechanical properties of hard and brittle materials, it is difficult to process them, and it is difficult for conventional metal cutting machine tools to process them.

Method used

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  • Self-adaption diamond-wire-saw cutting equipment
  • Self-adaption diamond-wire-saw cutting equipment
  • Self-adaption diamond-wire-saw cutting equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings; a self-adaptive diamond wire saw cutting device, comprising a frame (1), a horizontal feed mechanism located on the top of the frame (1), a lifting feed mechanism, and a rotation mechanism and drive mechanism;

[0026] The horizontal feed mechanism includes a stepper motor (3), a feed screw (5) and a feed nut that cooperate with the stepper motor (3) to move, and the horizontal feed mechanism is provided with a Leading screw (5) guide rail one (6) parallel to each other, described feed screw (5) is connected with the output shaft of stepper motor (3) by coupling one (4), described horizontal feeding mechanism and The lifting feed mechanism is detachably connected through a feed nut;

[0027] The lifting feed mechanism includes a lifting motor (7), a lifting screw (9) and a lifting nut that cooperate with the lifting motor to move, and a screw...

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Abstract

The invention discloses self-adaption diamond-wire-saw cutting equipment, and belongs to the technical field of diamond equipment. A rotating crystal ingot workpiece is cut through a diamond wire saw,driving wheels rotating at high speed and rotating back and forth drive the diamond wire saw to reciprocate, the diamond wire saw is tensioned by two tensioning wheels, air cylinders are arranged atthe tensioning wheels to guarantee the diamond wire saw to be in certain tension, and meanwhile two guiding wheels are additionally arranged to guarantee the cutting accuracy and the cutting face form. The rotating crystal ingot workpiece is installed on a three-jaw clamping disc, the three-jaw clamping disc is fixedly connected with a rotating mechanism, and is driven by a rotating motor, the rotating mechanism is fixedly connected with a lifting feeding mechanism, the lifting feeding mechanism is fixedly connected with a horizontal feeding mechanism, and the horizontal feeding mechanism is installed on a working table, and is driven by a stepping motor to feed. The whole device is controlled by a PLC, and is easy to control and convenient to operate.

Description

technical field [0001] The invention is mainly used to realize the precision cutting of brittle and hard materials, such as monocrystalline silicon, polycrystalline silicon, ceramics, glass, refractory materials, rock samples, ore samples, building materials, PCB boards, etc., and belongs to the technical field of diamond equipment; especially relates to a A diamond wire saw cutting device. Background technique [0002] Hard and brittle materials refer to materials with high hardness and high brittleness, such as single crystal silicon, gallium arsenide, special ceramics, glass ceramics, and some composite materials. Due to the special physical and mechanical properties of hard and brittle materials, it is difficult to process them, and it is difficult to process them with conventional metal cutting machine tools. [0003] At present, diamond wire saw cutting technology is a new hard and brittle material cutting technology developed in the past ten years. It has strong cutt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/04B28D7/00
CPCB28D5/0058B28D5/0082B28D5/045
Inventor 赵礼刚夏国锋刘宏西吴爱胜
Owner JIANGSU UNIV OF SCI & TECH
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