Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Microwave sensor based on substrate integrated waveguide and microfluidic technology

A substrate-integrated waveguide and microfluidic technology, applied in the field of sensors, can solve the problems of bulky sensors, unfavorable processing and integration, etc., and achieve the effect of light and thin volume, compact structure, and chemical inert expansion

Active Publication Date: 2019-01-18
SOUTHWEST UNIV
View PDF11 Cites 21 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention proposes a microwave sensor based on substrate-integrated waveguide and microfluidic technology. The purpose is to realize the miniaturization and planarization of the sensor by using the substrate-integrated waveguide technology, and solve the problem that the existing sensor is bulky and unfavorable for processing and integration. question

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microwave sensor based on substrate integrated waveguide and microfluidic technology
  • Microwave sensor based on substrate integrated waveguide and microfluidic technology
  • Microwave sensor based on substrate integrated waveguide and microfluidic technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to better describe the design process and purpose, the present invention will be further described below in conjunction with the embodiments and accompanying drawings:

[0032] like Figure 1 to Figure 5(a) As shown in Fig. 5(b), the microwave sensor based on substrate-integrated waveguide re-entrant cavity and microfluidic technology proposed by the present invention includes a substrate-integrated waveguide re-entrant cavity 1 and a piece embedded in the cavity microfluidic chip2.

[0033] The resonant cavity 1 is composed of an upper cover plate 1-1 and a lower base 1-2. Both the upper cover plate 1-1 and the lower base 1-2 include a three-layer structure, namely a top metal layer, an intermediate dielectric layer and a bottom metal layer.

[0034] Wherein the bottom metal layer of the upper cover plate 1-1 has the same area as the top metal layer of the lower base 1-2, and the two are glued together with conductive glue.

[0035] The material of the inte...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
widthaaaaaaaaaa
thicknessaaaaaaaaaa
depthaaaaaaaaaa
Login to View More

Abstract

The invention relates to a microwave sensor based on substrate integrated waveguide and a microfluidic technology. The microwave sensor comprises a substrate integrated waveguide reentry resonant cavity and a microfluidic chip embedded into the resonant cavity. The resonant cavity comprises an upper cover plate and a lower base. The upper cover plate and the lower base comprise top metal layers, middle medium layers and bottom metal layers; and two grooves that are symmetrical relative to a transverse axis are etched on the left side and the right side of the top metal layer of the upper coverplate. The microfluidic chip is embedded into a groove in a central area of the upper cover plate. The middle medium layers of the upper cover plate and the lower base comprise a plurality of metal through holes for connecting the top metal layers and the bottom metal layers. Annular grooves are formed in the lower base, and capacitive posts are formed in the centers of the annular grooves. According to the sensor, the microfluidic chip is introduced into the substrate integrated waveguide reentry resonant cavity, and the high-sensitivity and high-accuracy sensor that is non-invasive and reusable and is integrated with other plane circuits easily is obtained through the advantages of a highly-concentrated electric field of the reentry resonant cavity and precise micro fluid control capability of the microfluidic chip.

Description

technical field [0001] The invention belongs to the field of sensors, in particular to a microwave sensor suitable for measuring the complex dielectric constant of a liquid medium. Background technique [0002] The precise measurement of the complex permittivity of liquid media has a very wide range of research and applications in various disciplines and industrial fields. Through the precise measurement of the complex dielectric constant of the liquid medium, the rapid and accurate identification of the quality and specific components of the measured medium can be realized. For example, in the field of food processing and grading, the quality monitoring and grading of food can be realized by measuring the complex dielectric constant of milk and other liquid foods; in the petrochemical industry, the water content in the sample can be monitored by measuring the complex dielectric constant of the extracted crude oil sample . In addition, such as the measurement of the conten...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R27/26G01N22/00
CPCG01N22/00G01R27/2617
Inventor 魏治华黄杰徐国庆
Owner SOUTHWEST UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products