Photoresist stripper and photoresist stripping method
A technology of photoresist and stripper, which is applied in the field of photoresist stripper and photoresist stripping, and can solve the problems of process stability and work reproducibility reduction of stripper
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Embodiment 1
[0022] This embodiment is a photoresist stripping agent, including the following components in mass percentage, amine compound 19%, polar solvent 66%, anticorrosion agent 0.9%, water 14.1%.
[0023] The amine compound includes at least one selected from chain amine compounds and cyclic amine compounds.
[0024] Chain amine compounds include (2-aminoethoxy)-1-ethanol (AEE), aminoethylethanolamine (AEEA), monoethanolamine, N-methylethylamine (N-MEA), 1-aminoisopropyl One or more of alcohol (AIP), methyldimethylamine (MDEA), diethylenetriamine (DETA) and triethylenetetramine (TETA).
[0025] The cyclic amine compound includes one or more of imidazolyl-4-ethanol (IME), aminoethylpiperazine (AEP) and hydroxyethylpiperazine (HEP).
[0026] Polar solvents include aprotic polar solvents and protic polar solvents.
[0027] Aprotic polar solvents are dimethylsulfoxide, N-methylformamide, N-methyl-2-pyrrolidone, N,N-dimethylacetamide, N,N-dimethylformamide, N, One or more of N-diethyl...
Embodiment 2
[0035] The difference with respect to embodiment 1 is:
[0036] This embodiment is a photoresist stripper, which includes the following components in mass percentage, 10% of amine compound, 75% of polar solvent, 0.5% of anticorrosion agent, and 14.5% of water.
[0037] Anticorrosion agents include catechol, pyrogallol, gallic acid, phthalic acid, and phthalic anhydride, and the ratio of each component is 1:0.5:0.3:0.5:1.
Embodiment 3
[0039] The difference with respect to embodiment 1 is:
[0040] This embodiment is a photoresist stripping agent, including the following components in mass percentage, 25% of amine compound, 55% of polar solvent, 1.2% of anticorrosion agent, and 18.8% of water.
[0041] Anticorrosion agents include catechol, pyrogallol, gallic acid, phthalic acid, and phthalic anhydride, and the ratio of each component is 2:0.2:0.7:0.4:2.
[0042] When the above-mentioned embodiment is applied, the photoresist can be stripped at low temperature in a short time, and has excellent stripping ability, and there is no photoresist residual substance on the substrate after washing; the photoresist stripper Has low corrosion, prevents the metal film or insulating film under the photoresist from being damaged, does not interact with the solvents that make up the stripper, storage stability of the stripper, and the mixed solvent of the photoresist It is inert and high-temperature stable; considering t...
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