Electroplating post-processing process for silver-plate copper wire

A silver-plated copper wire and post-processing technology, which is applied in the direction of metal material coating process, superimposed layer plating, coating, etc., can solve the problems of easy discoloration, loss of luster, and difficulty in removing the color of the silver-plated layer, etc., to achieve The effect of enhancing anti-corrosion ability and preventing the generation of sulfide

Active Publication Date: 2019-02-01
YANGZHOU HY TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when silver encounters sulfur and sulfide, the surface is easy to change color and lose luster, forming brown to black silver sulfide, which will reduce the ability of reflection, conductivity, riveting and appearance quality
[0004] The Chinese patent library discloses a cyanide-free production process for silver-plated copper-clad steel wire (CN104195612A), which discloses a method for passivating silver-plated copper-clad steel wire by using a mixture of potassium dichromate and potassium carbonate. However, because the solution of potassium dichromate is orange-red, soaking silver-plated copper wire in potassium dichromate is easy to leave color on the surface, and the washing process after passivation takes a short time, and it is difficult to remove the color on the silver-plated layer. , thus affecting the appearance of the silver-plated copper wire
At the same time, the above operations only form a protective film on the surface of the silver-plated layer, which makes the anti-sulfurization ability of the silver-plated layer weak

Method used

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  • Electroplating post-processing process for silver-plate copper wire
  • Electroplating post-processing process for silver-plate copper wire
  • Electroplating post-processing process for silver-plate copper wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0084] In this embodiment, a copper wire with a wire diameter of 0.78 mm is selected. Proceed as follows:

[0085] 1. Degreasing step

[0086] The degreasing solution includes the following components in parts by weight: 5 parts of electrolytic degreasing agent, 0.1 part of sodium hydroxide and 40 parts of pure water, the electrolysis current is 1A, and the temperature is 60°C.

[0087] 2. Three washing steps

[0088] 3. Activation step

[0089] The activation solution includes the following components: 1.8L of concentrated hydrochloric acid, 150g of sulfamic acid and 30L of pure water.

[0090] 4. Second washing step

[0091] 5. Nickel plating step

[0092] The nickel plating solution contains components at the following concentrations: 300g / L nickel sulfamate, 7g / L nickel chloride and 40g / L boric acid; the nickel electroplating current is 5A, and the temperature is 50°C.

[0093] 6. Pre-plating step

[0094] The pre-plating silver solution contains the following compo...

Embodiment 2

[0108] In this embodiment, a copper wire with a wire diameter of 1.0 mm is selected. Proceed as follows:

[0109] 1. Degreasing step

[0110] The degreasing solution includes the following components by weight: 6 parts of electrolytic degreasing agent, 0.2 parts of sodium hydroxide and 45 parts of pure water, the electrolysis current is 2A, and the temperature is 62°C.

[0111] 2. Three washing steps

[0112] 3. Activation step

[0113] The activation solution includes the following components: 1.85L of concentrated hydrochloric acid, 180g of sulfamic acid and 32L of pure water.

[0114] 4. Second washing step

[0115] 5. Nickel plating step

[0116] The nickel plating solution contains components at the following concentrations: 320g / L nickel sulfamate, 9g / L nickel chloride and 42g / L boric acid; the nickel plating current is 10A, and the temperature is 52°C.

[0117] 6. Pre-plating step

[0118] The pre-silvering solution contains the following components by volume: 60...

Embodiment 3

[0132] In this embodiment, a copper wire with a wire diameter of 1.15 mm is selected. Proceed as follows:

[0133] 1. Degreasing step

[0134] The degreasing solution includes the following components in parts by weight: 7 parts of electrolytic degreasing agent, 0.4 parts of sodium hydroxide and 50 parts of pure water, the electrolysis current is 5A, and the temperature is 65°C.

[0135] 2. Three washing steps

[0136] 3. Activation step

[0137] The activation solution includes the following components: concentrated hydrochloric acid 1.9L, sulfamic acid 200g and pure water 35L.

[0138] 4. Second washing step

[0139] 5. Nickel plating step

[0140] The nickel plating solution contains components at the following concentrations: 350g / L nickel sulfamate, 10g / L nickel chloride and 45g / L boric acid; the nickel plating current is 20A, and the temperature is 55°C.

[0141] 6. Pre-plating step

[0142] The pre-plating solution contains the following components by volume: 80 ...

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Abstract

The invention belongs to the technical field of electroplating, and provides an electroplating post-processing process for a silver-plate copper wire. The electroplating post-processing process for the silver-plate copper wire comprises the step of passivating a plating piece electroplated with silver. The passivation treatment step comprises an electrolysis protection step and a chemical passivation step carried out sequentially; according to the electrolysis protection step, electrolysis protection powder is adopted for carrying out electrolysis protection treatment and is dissolved in an electrolysis protection tank filled with pure water; and according to the chemical passivation step, kangli tablets are adopted for carrying out chemical passivation treatment, and the plating piece isfed into a chemical passivation groove containing the kangli tablets and pure water. According to the electroplating post-processing process for the silver-plate copper wire provided by the invention,the electrolysis protection powder is firstly adopted for carrying out electrolysis protection treatment on the silver-plate copper wire, the kangli tablets are adopted for carrying out chemical passivation treatment on the silver-plate copper wire, and a transparent anti-oxidation film is formed on the surface of a silver coating through the double passivation treatment on the silver-plate copper wire, so that the generation of sulfide can be prevented, the corrosion prevention of the surface of the silver coating can be improved, and meanwhile, the characteristics of the surface of the silver coating cannot be changed.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating post-treatment process for silver-plated copper wires. Background technique [0002] Silver-plated copper wire is a thin wire drawn by a wire drawing machine after silver-plating high-quality oxygen-free copper wire or low-oxygen copper wire. It has excellent electrical conductivity, thermal conductivity, corrosion resistance and high temperature oxidation resistance. . Silver-plated copper wire is widely used in electronics, communications, aerospace, military and other fields to reduce the contact resistance of the metal surface and improve welding performance. [0003] Silver is a white, bright, malleable, plastic and reflective metal with good electrical conductivity and weldability. Silver has high chemical stability and can resist the corrosion of alkali and some organic acids. It is not in the general air. It reacts with oxygen, and silver is als...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C22/05C25D3/12C25D3/46C25D5/12C25D5/34C25F1/04C25D7/06C23C28/00
CPCC23C22/05C23C28/322C25D3/12C25D3/46C25D5/12C25D5/34C25D7/0607C25F1/04Y02P10/20
Inventor 王秋旭王永凤
Owner YANGZHOU HY TECH DEV
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