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Cage-shielded interposer inductances

An intermediary and inductor technology, applied in the direction of inductors, fixed inductors, printed inductors, etc., can solve the problem that it is difficult for receiving equipment to determine which code elements to send

Active Publication Date: 2019-02-05
CREDO TECH GRP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the symbol rate increases, ISI can make it difficult for a receiving device to decide which symbols to send in each interval (especially when this ISI is combined with additive noise)

Method used

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  • Cage-shielded interposer inductances
  • Cage-shielded interposer inductances
  • Cage-shielded interposer inductances

Examples

Experimental program
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Embodiment Construction

[0041] The disclosed devices and methods are best understood with reference to an illustrative context. therefore, figure 1An illustrative communication network 100 is shown having devices that will be connected at end nodes 110 through 122 (the end nodes represent mobile devices, portable computers, workstations, servers, network-attached storage systems, and other such communication sources) A communication link 108 interconnects nodes 102, 104, 106 (representing switches, routers, base stations, gateways, and other forms of communication equipment) that direct and relay communication signals between and destinations). Communication network 100 may be or include, for example, the Internet, a wide area network, or a local area network.

[0042] Communication link 108 may be a wired or wireless communication channel. In one example, the communication link may be a fiber optic cable having fiber optic bundles each carrying a plurality of modulated optical signals on a corresp...

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PUM

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Abstract

Disclosed microelectronic assemblies employ an integrated interposer cage to reduce electromagnetic interference with (and from) high-frequency components. One illustrative embodiment includes: at least one IC die having drive cores for a plurality of oscillators, the IC die attached in a flip-chip configuration to a (interposer) substrate, the substrate having: multiple inductors electrically coupled to said drive cores and each enclosed within a corresponding conductive cage integrated into the substrate to reduce mutual coupling between the inductors and noise coupled through substrate. Anillustrative interposer embodiment includes: upper contacts arranged to electrically connect with micro bumps on at least one IC die; metallization and dielectric layers that form multiple inductors each surrounded by bars of a conductive cage; lower contacts arranged to electrically connect with bumps on a package substrate; and a substrate with a plurality of TSVs (through-silicon vias) that electrically couple to the lower contacts. Each of the bars includes: at least one of said TSVs, at least one via through the metallization and dielectric layers, and at least one upper contact.

Description

Background technique [0001] Digital communications occur between a sending device and a receiving device over an intermediate communications medium (eg, fiber optic cable or insulated copper wire) having one or more designated communication channels (eg, carrier wavelengths or frequency bands). Each transmitting device typically transmits symbols at a fixed symbol rate, while each receiving device detects the (possibly corrupted) symbol sequence and attempts to reconstruct the transmitted data. [0002] A "symbol" is a state or active state of a channel that lasts for a fixed period of time called a "symbol interval". A symbol may be, for example, a voltage or current level, an optical power level, a phase value, or a specific frequency or wavelength. A change from one channel state to another is called a symbol transition. Each symbol can represent (ie, encode) one or more bits of binary data. Alternatively, data may be represented by symbol transitions or by sequences of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/52H05K9/00
CPCH01L23/5383H01L23/5384H01L23/5385H01L23/49816H01L2224/16227H01L2924/3025H01L2924/15311H01F17/0013H01F2017/002H01F2017/008H01L23/5386H01L23/552H01L23/645H01L24/16H01L24/81H01L2224/81801H03B5/1212H03B5/1228H04L7/0008
Inventor 刘西柯戴逸飞
Owner CREDO TECH GRP LTD