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A thermal wind speed and direction sensor based on bonding process and its preparation method

A technology of wind speed, wind direction, and bonding process, which is applied in chemical instruments and methods, separation methods, metal processing equipment, etc., can solve problems affecting the measurement accuracy of sensors, avoid lateral heat loss, reduce temperature drift, and improve environmental temperature adaptation sexual effect

Active Publication Date: 2020-06-12
CHANGZHOU UNIV
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  • Description
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Problems solved by technology

However, due to the use of thermal principles for detection, the material parameters in the sensor change significantly with the ambient temperature, and the temperature drift characteristics of the sensor are obvious, which seriously affects the measurement accuracy of the sensor

Method used

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  • A thermal wind speed and direction sensor based on bonding process and its preparation method
  • A thermal wind speed and direction sensor based on bonding process and its preparation method

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Embodiment Construction

[0025] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0026] Such as figure 1 A thermal wind speed and direction sensor based on a bonding process is shown, which has a sensor chip, and the sensor chip includes a silicon dioxide heat insulating layer 4, and a central temperature measuring element 7, four One heating element 8 and four upstream and downstream temperature measuring elements 9, wherein the central temperature measuring element 7 is located at the center of the silicon dioxide heat insulating layer 4, and the four heating elements 8 are evenly distributed in the center around the center of the silicon dioxide heat insulating layer 4 Around the outside of the temperature measuring element 7, the four...

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Abstract

The invention relates to a hot-type wind speed and wind direction sensor based on a bonding technology and a making method of the sensor. The sensor is provided with a sensor chip, the sensor chip comprises a silicon dioxide heat insulation layer, and a silicon column is distributed in the silicon dioxide heat insulation layer; a central temperature measurement element, a heating element and an upstream and downstream temperature measurement element are arranged on the portion, corresponding to the silicone column, of the back face of the silicon dioxide heat insulation layer separately, the central temperature measurement element is located in the center of the silicon dioxide heat insulation layer, and the periphery of the heating element is distributed with the central temperature measurement element as the center to form a central symmetry structure; the periphery of the upstream and downstream temperature measurement element is distributed with the central temperature measurementelement as the center to form a central symmetry structure, and the upstream and downstream temperature measurement element is located on the periphery of the heating element. According to the sensor,by using the bonding technology, the silicon column structure is formed in the silicon dioxide heat insulation layer, horizontal transmission loss of heat can be effectively insulated, the power consumption of the sensor is reduced, when the environment temperature is changed, the change of material characteristics of the chip is reduced, and accordingly temperature drift of an output result of the sensor is effectively inhibited.

Description

technical field [0001] The invention relates to a thermal wind speed and direction sensor based on a bonding process and a preparation method thereof. Background technique [0002] Wind speed and direction sensors are widely used in construction machinery, weather early warning, smart agriculture, wind power generation and other fields. Thermal wind speed and direction sensors have the advantages of fast response time, batch manufacturing, and small size, and are widely used in daily production and life. However, due to the use of thermal principles for detection, the material parameters in the sensor change significantly with the ambient temperature, and the temperature drift characteristics of the sensor are obvious, which seriously affects the measurement accuracy of the sensor. Contents of the invention [0003] The technical problem to be solved by the present invention is: in order to overcome the deficiencies in the prior art, the present invention provides a therm...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P5/12B81B1/00B81C3/00G01P13/02
CPCB81B1/00B81B2201/0292B81B2203/0361B81C3/001G01P5/12G01P13/02
Inventor 陈蓓朱雁青袁宁一丁建宁
Owner CHANGZHOU UNIV
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