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Preparation and application of a tackifier for addition-type silicone heat-conducting potting adhesive

A heat-conducting potting and organosilicon technology, used in adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems such as the failure of the platinum catalyst of the addition type silicone rubber, the unsatisfactory stability and adhesion, etc. To achieve excellent bonding effect, reduce self-polymerization, reduce the effect of substituent groups

Active Publication Date: 2021-02-26
东莞市佳迪新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, among the above two tackifiers, the organotin will invalidate the addition-type silicone rubber platinum catalyst, and the titanium catalyst will dehydrogenate the cross-linking agent hydrogen-containing silicone oil in the addition-type silicone rubber. Sex and cohesion are still not meeting existing needs

Method used

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  • Preparation and application of a tackifier for addition-type silicone heat-conducting potting adhesive
  • Preparation and application of a tackifier for addition-type silicone heat-conducting potting adhesive
  • Preparation and application of a tackifier for addition-type silicone heat-conducting potting adhesive

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preparation example Construction

[0032] The preparation method of the tackifier for the addition-type silicone heat-conducting potting adhesive of the present invention comprises the following steps:

[0033]Step 1: Add 480-520 parts by weight of vinyl-containing polysiloxane with hydroxyl-terminated side groups and 608-658 parts by weight of ND-42 (silane coupling agent) into a reactor with constant temperature stirring function, and stir (stirring speed is 200-220 rev / min) to 115±2°C, add 1-2 parts by weight of alkali glue, and keep warm for 10-30 minutes; wherein, in the polysiloxane with vinyl group in terminal hydroxyl side group , the hydroxyl content is 6%-8%wt, the ethylene content is 3%-4%wt; ND-42 is anilinomethyltriethoxysilane, which can be used in the bonding of silicone rubber with metal, plastic and other materials; Alkali gum is an alkaline catalyst, and the addition method of alkali gum is dropwise. In this embodiment, alkali gum is obtained by the following method: 500 parts of vinyl silicon...

Embodiment 1

[0038] The raw materials used in this embodiment and the ratio of raw materials are as shown in Table 1:

[0039] Table 1 raw materials and ratio

[0040]

[0041] Using the ratio of raw materials in Table 1, the tackifier for the addition-type silicone heat-conducting potting adhesive of the present invention is prepared by the following steps:

[0042] (1) Add vinyl-containing polysiloxane and ND-42 into a reactor with a constant temperature function, adjust the mixer speed to 190 rpm, stir and heat up to 115±2°C, and then add alkali Glue, keep warm for 20 minutes;

[0043] (2) The temperature rises to 140±2°C, and the temperature is kept for 0.5 hours;

[0044] (3) The temperature is raised to 150±2°C, and the low molecular weight is removed by negative pressure for 1 hour; the temperature is lowered, and the material is discharged to obtain an addition-type silicone heat-conducting potting adhesive tackifier.

Embodiment 2

[0046] The raw materials used in this embodiment and the ratio of raw materials are as shown in Table 2:

[0047] Table 2 raw materials and ratio

[0048]

[0049] Using the raw material ratio in Table 2, the tackifier for the addition-type silicone heat-conducting potting adhesive of the present invention was prepared through the following steps:

[0050] (1) Add vinyl-containing polysiloxane and ND-42 into a reactor with a constant temperature function, adjust the mixer speed to 190 rpm, stir and heat up to 115±2°C, and then add alkali Glue, keep warm for 20 minutes;

[0051] (2) The temperature rises to 140±2°C, and the temperature is kept for 0.5 hours;

[0052] (3) The temperature is raised to 150±2°C, and the low molecular weight is removed by negative pressure for 1 hour; the temperature is lowered, and the material is discharged to obtain an addition-type silicone heat-conducting potting adhesive tackifier.

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Abstract

The invention discloses a preparation method of a tackifier for addition-type silicone heat-conducting potting adhesive, which comprises 480-520 parts by weight of vinyl-containing polysiloxane with terminal hydroxyl side group, 608-658 parts by weight of ND ‑42 is added to the reactor with constant temperature stirring function, after stirring and heating up, add 1-2 parts by weight of alkali glue, keep warm for 10-30 minutes; heat up to 140±2°C, keep warm for 30 minutes; then heat up to 150±2°C 2°C, vacuum negative pressure to remove low molecules for 1 hour; cool down, discharge, and obtain addition-type silicone heat-conducting potting adhesive tackifier. Among them, the vinyl group and aniline group are introduced into the tackifier structure, and the vinyl group participates in the reaction of the addition-type silicone heat-conducting potting glue, and the potting glue and the tackifier are bonded through a chemical bond reaction; the aniline group As a group with strong bonding effect, the group can play an excellent bonding effect on most metals and plastics at room temperature.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and more specifically relates to a tackifier for addition-type silicone heat-conducting potting adhesive, its preparation method and its application. Background technique [0002] With the rapid development of society, electronic technology is also changing with each passing day. The integration and modularization of electronic components are becoming more and more refined. The heat dissipation function and waterproof and moisture-proof requirements of products are also getting higher and higher. Therefore, the demand for packaging materials with excellent performance is also increasing. Big. [0003] Addition-type silicone heat-conducting potting material has good temperature resistance, fast curing speed, convenient use, high production efficiency, non-toxic and tasteless, and its base polymer has low viscosity, good compatibility with heat-conducting materials, and can be filled in l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J11/04
CPCC08L2203/206C08L2205/025C08L2205/035C09J11/04C09J183/04C08L83/04C08K3/042
Inventor 周群邦
Owner 东莞市佳迪新材料有限公司
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