A 64-channel analog quantity acquisition BGA package chip

Abstract

The invention relates to the technical field of telemetry communication, and discloses a 64-way analog acquisition BGA packaging chip, including a substrate, a bare chip and solder balls; the substrate includes a stacked wiring layer, a ground layer, a power layer, a bottom layer, and a first conductive The connection unit, the second conductive connection unit and the third conductive connection unit; the surface of the wiring layer is provided with a first pad as a first bonding point at a position corresponding to the first conductive connection unit, and at a position corresponding to the second conductive connection unit A second bonding pad is provided as a second bonding point, and a third bonding pad is provided as a third bonding point at a position corresponding to the third conductive connection unit; the AD chip in the bare chip and the second bonding point on the wiring layer It is electrically connected to the third bonding point, and the operational amplifier and the analog gate are electrically connected to the first bonding point and the second bonding point on the wiring layer; the substrate structure of the present invention is compact, and the space utilization rate is high, and the bare chip is used for circuit design and packaging. The volume is reduced by about 85%, which improves the versatility of the chip.

Description

Technical field[0001]The present invention belongs to the field of telemetry communication technology, and more particularly to a 64-way analog quantity acquisition BGA packaging chip.Background technique[0002]In telemetry communication technology, telemetry editing circuits are mainly responsible for the conditioning and acquisition of multiple sensor signals. The analog acquisition module is an important part of telemetry editing circuit, and its functions are analog conditioning, selection and AD acquisition. In the aerospace field, the sample rate in various sensors is required to impact sensors, and the number of shock sensors generally samples no more than 6 channels, and the sampling rate is not more than 20kHz. It is necessary to design a multi-channel analog acquisition module, not only can be completed Impact sensor 6 data acquisition, and data acquisition of other sensors can also be completed. 64 Road analog acquisition module (including 4 simulative gates) The sample ra...

AI Technical Summary

Problems solved by technology

[0004] Aiming at at least one defect or improvement requirement of the prior art, the present invention provides a 64-way analog acquisition ball grid array (BGA) packaged chip, which aims at solving the simulation problem of the existing printed board level assembly. The volume acquisition module is large in size, high in cost, and poor in versatility

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