Chemical silver plating solution for surface treatment of printed circuit board (PCB)

A printed circuit board, chemical silver plating technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of assembly limitation, high cost, difficult operation, etc. Weldability effect

Inactive Publication Date: 2019-03-05
深圳市虹喜科技发展有限公司
View PDF5 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The increase in the use of nickel immersion gold process has eliminated tin spraying, but the nickel immersion gold process is difficult to operate and expensive in PCB production
Organic solder protection is easy to operate and low in cost in PCB production, but it is limited in assembly, such as assembly board electrical testing and flux matching

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chemical silver plating solution for surface treatment of printed circuit board (PCB)
  • Chemical silver plating solution for surface treatment of printed circuit board (PCB)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] EDTA 15g

[0051] Copper nitrate 0.3 g

[0052] 18 carbon methyl stearate 1.1g

[0053] Tolyltriazole 1.0g

[0054] Silver nitrate 1.0 g

[0055] 6 grams of nitric acid to adjust the acidity of the solution to 0.12

[0056] Distilled water to make up to 1 liter.

Embodiment 2

[0058] EDTA 20g

[0059] Copper nitrate 0.5 g

[0060] 18 carbon methyl stearate 15g

[0061] Tolyl benzotriazole 2.0 g

[0062] Silver nitrate 2.0 g

[0063] 8 grams of nitric acid to adjust the acidity of the solution to 0.12

[0064] distilled water up to 1 liter

[0065] The electroless silver plating solution for surface treatment of printed circuit boards of the present invention can deposit a metal silver layer on the copper circuit of the circuit board; the thickness of the formed silver plating layer is uniform, between 0.15-0.3 microns; it can effectively guarantee the subsequent assembly of the circuit board Solderability of components; can withstand 5 times of reflow soldering without changing color; can ensure that the bite of copper wire does not exceed 10% of the copper thickness; can ensure that there is no rust or discoloration after 24 hours of neutral salt spray.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a chemical silver plating solution for the surface treatment of a printed circuit board (PCB). The chemical silver plating solution (1L) comprises following raw materials by weight: 10 to 100 grams of complexing agent, 0.1 to 3.0 grams of Cu<2+>, 0.5 to 15 grams of surfactant, 0.1 to 5.0 grams of copper antioxidant, 0.4 to 1.0 gram of silver ion, enough nitric acid, which can adjust the pH of the silver plating solution to 0.08-0.3, and the balance being distilled water. The chemical silver plating solution can form a silver layer on the copper circuits on a printed circuit board; the thickness of the silver layer is uniform and is in a range of 0.15 to 0.3 millimeter; after the surface treatment, other elements can still be welded on the PCB; the color is not changed after five times of reflow soldering; less than 10% of the thickness of copper layers of copper wires is corroded; and the processed PCB will not be corroded and the color will not change after thePCB is placed in neutral salt fog for 24 hours.

Description

technical field [0001] The invention relates to the production field of printed circuit boards, more specifically, the surface treatment process of printed circuit boards, and an electroless silver plating solution for soldering the copper circuits of the circuit boards. Background technique [0002] Nowadays, HASL is no longer suitable for the design of thinner PCB and denser lines, so there have been many researches on functionally optional products. The increase in the use of the nickel immersion gold process has eliminated tin spraying, but the nickel immersion gold process is difficult to operate and expensive in PCB production. Organic solder protection is easy to operate and low in cost in PCB production, but it is limited in assembly, such as assembly board electrical testing and flux matching. Electroless silver plating can make the circuit very flat, suitable for high-density circuit, fine-pitch SMT (surface mount), BGA (ball array package) and chip direct mountin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/42
CPCC23C18/42
Inventor 吴旭明蔡良胜
Owner 深圳市虹喜科技发展有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap